Power conversion device
A power conversion device, semiconductor technology, applied in the direction of output power conversion device, conversion of AC power input to DC power output, transportation and packaging, etc., can solve the problems of no circuit inductance consideration, inability to fully reduce inductance, etc., to achieve reduction Effect of wiring inductance
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no. 1 example
[0048] figure 1 is a perspective view showing the conductor plate structure of the power conversion device according to the first embodiment of the present invention, figure 2 It is an exploded perspective view of the laminated conductor plate of the first embodiment of the present invention.
[0049] exist figure 1 and figure 2 In the shown mounting example, like Patent Document 1, semiconductor modules 111 and 112 are connected in parallel so that their respective terminals are arranged close to each other, and positive electrode P1 and negative electrode N1 are arranged side by side on the same side.
[0050] Among the conductor plates used as wiring, the conductor plates on the positive side include a first conductor plate 51 connected to the DC positive terminal P1 and a second conductor plate 52 connected to the DC positive terminal P2. As the conductor plate on the negative side, there is a conductor plate 53 connected to the DC negative terminal N1 and the DC nega...
no. 2 example
[0066] Figure 5 is a perspective view showing the conductor plate structure of the power conversion device according to the second embodiment of the present invention, Figure 6 is an exploded perspective view of a laminated conductor plate according to a second embodiment of the present invention. Wherein, the structure of the conductor plates 53 and 62 on the negative side is the same as figure 1 and figure 2 The structure of the first embodiment shown is the same. The conductor plate on the positive electrode side is configured such that the first connection terminal 512 and the second connection terminal 522 are electrically connected in direct contact and are also directly connected to the connection terminal 611 of the conductor plate 61 .
[0067] By adopting the above structure, the area occupied by the circuit between the clamp capacitors can be further reduced, so the effect of reducing the inductance is greater.
[0068] On the other hand, if Figure 6 As sho...
no. 3 example
[0070] Figure 7is a perspective view showing the conductor plate structure of the power conversion device according to the third embodiment of the present invention, Figure 8 It is an exploded perspective view of a laminated conductor plate according to a third embodiment of the present invention.
[0071] It is the same as the second embodiment in that the first connection terminal 512 and the second connection terminal 522 are electrically connected by directly contacting each other. In the third embodiment, the connection terminal 533 on the negative electrode side is provided at one location without being divided.
[0072] Since only one gap is required for securing the insulation of the connection terminal, the width of the conductor portion of the connection terminal can be increased. However, since the connection terminal 533 is near the DC negative terminal N1 and far from the other DC negative terminal N2, the current flowing to the smoothing capacitor 3 via the n...
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