113results about How to "Shorten wire length" patented technology

The invention provides a three-dimensional memory and a manufacturing method of the three-dimensional memory. The three-dimensional memory comprises a core storage circuit and a peripheral circuit. Atleast one storage string is formed in the core storage circuit. The three-dimensional memory also comprises a substrate, wherein the peripheral circuit is formed on the substrate; a common source electrode line layer which is formed on the peripheral circuit and electrically connected with the peripheral circuit; and a doped semiconductor material layer which is formed on the common source electrode line layer, wherein the core storage region is arranged on the semiconductor material layer.

A cell according to the present invention comprises a plurality of terminals capable of transmitting an input signal or an output signal and serving as a minimum unit in designing a semiconductor integrated circuit, wherein the plurality of terminals is located on routing grids lined in a Y direction which is a direction vertical to a power-supply wiring of the cell used in automatic placement & routing and has a shape extended in an X direction which is a direction in parallel with the power-supply wiring, more specifically such a shape that, for example, a longer-side dimension of the terminal is equal to ''a routing grid interval in the X direction+a wiring width. According to the constitution, a cell area is reduced, which advantageously leads to the reduction of a chip area.

This invention relates to one chip imbed module structure ,which comprises dielectric layer, at least one layer of semiconductor chip and at least one circuit structure, wherein, the structure is connected to semiconductor slice through several conductive structures; backward module structure is imbedded into electron device through dielectric layer circuit structure and electron devices. The invention chip module structure applies each electron device process to make the circuit structure connected to electron device through each conductor.

Phase coils are each configured by winding a conductor wire in a concentrated winding consecutively on three circumferentially consecutive tooth portions, six inverter units of an inverter module are each disposed in close proximity to a motor so as to face each of the phase coils axially, and the motor and the inverter module are electrically connected by connecting an alternating-current output terminals of each of the plurality of inverter units to output wires of the phase coils that face the inverter units axially.

The invention provides a display panel and a display device to reduce the step width of the display panel. The display panel comprises a display area, a non-display area which comprises an integratedcircuit binding area and a fan-out area, signal lines which comprise first and second signal lines in the display area, and fan-out traces which comprise a first fan-out trace and a second fan-out trace. The first fan-out trace and the second fan-out trace are both located in the fan-out area. The first fan-out trace is electrically connected with the first signal line. The second fan-out trace iselectrically connected with the second signal line. The first fan-out trace is electrically connected with a first terminal of an integrated circuit binding area through a first side. The second fan-out trace is electrically connected with a second terminal of the integrated circuit binding area through a second side. The first side and the second side are two different sides in the integrated circuit binding area.

Provided is a method for manufacturing a printed-circuit board, which can form bumps at substantially identical heights on connection pads having different opening diameters of a solder resist. Diametrically-small bumps (78S), which are made high of solder balls (77) mounted in diametrically-small openings (71S) of a solder resist layer (70), are flattened to have the same height as that of the solder bumps (78P) of diametrically-large openings (71P). The solder bumps (78S) of the diametrically small openings (71S) and the solder bumps (78P) of the diametrically large openings (71P) are identical in the solder quantity. No connection occurs at the solder bumps (78S) of the diametrically small openings (71S) so that the connection reliability between an IC chip (90) and a multilayer printed-circuit board (10) can be retained.

The invention discloses a planar array microwave antenna for a dual-beam traffic information detection radar; the antenna is formed by connecting one group of 20 serial planar antenna units with another group of 20 serial planar antenna units in parallel, and a central side-feed form is used for feeding to an antenna array; the planar array microwave antenna for dual-beam traffic information detection radar has the advantages that a pair of antennas can produce two beam main lobes between which an included angle, namely the included angle between the beam main lobes of the dual-beam antenna is formed, and the included angle completely meets the demands of the dual-beam traffic information detection radar; the central side-feed form is more favorable for the integration of a radar transmitting-receiving assembly and the antenna; and furthermore, the wiring length of the radar transmitting-receiving assembly can be shortened to reduce the microwave radiation loss and reduce the radar cross section area.

The embodiment of the present invention provides an optical device which relates to the optical communication field, and can satisfy the impedance matching requirement of the high frequency signal transmission. The optical device comprises a first substrate, a second substrate and a transfer plate, a first conductive access is arranged on the upper surface of the first substrate, a second conductive access is arranged on the lower surface of the first substrate, and a third conductive access is arranged on the upper surface of the second substrate. A microstrip line structure is arranged on the transfer plate and comprises a transfer line arranged on the upper surface of the transfer plate, and the upper surface of the second substrate is opposite to the lower surface of the first substrate, wherein the second conductive access is attached to the third conductive access, and the transfer plate is arranged above the upper surface of the second substrate and is located in the third conductive access. One end of the transfer line is electrically connected with the first conductive access by threading, and the other end is connected with an internal element in the optical device by threading. The embodiment of the present is used for the optical device manufacture.

The invention discloses a low-cost traffic information detecting radar device. A microwave signal source generates a millimeter wave by adopting a dielectric oscillator; a receiving and transmitting assembly is used for receiving and transmitting a signal by a planar array antenna; a frequency mixer is used for outputting and transmitting an intermediate frequency signal to an intermediate frequency signal processing unit for processing; the processed intermediate frequency signal is transmitted to a digital signal processing unit; the digital signal processing unit is connected with a man-machine interface unit; and after the intermediate frequency signal containing traffic information is processed by the digital signal processing unit, the man-machine interface unit outputs the traffic information. The invention has the advantage of judging the existence of vehicles by utilizing speed information, thereby greatly reducing the cost.

A coreless wiring board has no core board but a laminated structure in which a conductor layer and resin insulating layers are alternately laminated into a multilayer. Each of the resin insulating layers is formed to contain a glass cloth in an epoxy resin. A plurality of via holes is formed to penetrate each of the resin insulating layers, and a filled via conductor for electrically connecting the conductor layers is formed in the via holes respectively. A tip of the glass cloth contained in each of the resin insulating layers is protruded from an internal wall surface of the via hole and cuts into a sidewall of the filled via conductor.

The invention relates to a method for optimizing FPGA chip layout based on an area clock. The method comprises following steps: initializing a netlist; instantiating area clock buffers (rbufs) and registers (regs); determining the connection relationships between the rbufs and the regs; packaging one rbuf and multiple regs driven by the rbuf into a macrocell according to the connection relationships; carrying out global layout based on the macrocells; determining the layout area of each macrocell; carrying out partial layout in the layout area; and determining the layout location of each reg in each macrocell. According to the method provided by the invention, the physical locations of the registers driven by the same area clock can be arranged in a relatively small area; the FPGA layout is optimized; the wiring length of the follow-up clock line is reduced; the wiring performance is improved; and the power consumption of the FPGA chips is reduced.

The invention discloses an optimization structure based on an inverter welding machine main circuit. The optimization structure comprises a main circuit, wherein the main circuit comprises an absorption capacitor, an IGBT (Insulated Gate Bipolar Transistor) module, a rectification module, a low-inductance busbar and a gate pole driving line, wherein the absorption capacitor, the IGBT module, the rectification module and the low-inductance busbar are arranged on a radiator by virtue of a compact structure, the absorption capacitor is connected to the IGBT module by directly utilizing a pin, thus ensuring the shortest effect of connection of the capacitor and the circuit and optimizing the absorption action; and the IGBT module and the rectification module are connected directly by virtue of the low-inductance busbar, thus ensuring the shortest connection distance and reducing the parasitic inductance.

The invention is to implement large capacity of a power conversion device without increasing size of the device. The provided power conversion device comprises: a first conductor electrode with a plate-shaped part and a vertical part, the plate-shaped part is connected with anode terminal or cathode terminal of a capacitor and roughly parallel mounted with planes setting each terminal so as to cover the capacitor group, the vertical part is connected with direct current side of the first power conversion circuit and vertical to the planes; and a second conductor electrode with a similar plate-shaped part, a part which is connected with vertical part of the first conductor electrode and vertical to the planes and a part which is connected with direct current side of the second power conversion circuit and vertical to the planes. Thus, degree of non-homogeneous of current running through each capacitor may be alleviated such that large capacity may be implemented without increasing size of the power conversion device.

The invention relates to a range hood. Brand new design is adopted for a mechanical structure, a working mode, a purification mode, a flue structure, a circulation mode and a control mode of an existing range hood. Efficiency, energy-saving performance and cleaning performance are higher. The range hood comprises a range hood body 1, a straight-through gas duct and a hemispherical and double-arc plasma electrostatic blade 7, a valve capable of being opened and closed, an indoor gas outlet 8 capable of being linked, a venturi principle gas inlet and gas outlet flue 9, an exhaust gas recirculation pipeline 11, an EGR control valve 12, a venturi tube type EGR system 13, an exhaust gas circulating system 14 with a machine turbochargning device and a turbocharging device, a flow guide vane 15 with an adjustable section, an exhaust pipe 16 allowing a hole in an exhaust tube for exhausting circulation of the range hood, a 4-2-1 exhaust tube 17, a single-turbine double-vortex tube 18 and a smoke machine shell cavity integrated type pipeline 19, wherein a centrifugal fan 2 is replaced with a movable vane adjustable axial flow fan and a mixed flow (oblique flow) booster fan; the fans can also be connected in parallel and connected in series, and the rotating speed can be adjusted; an impeller adopts three-element flow blade design 4; guide grooves 5 and a fan blade fairing 6 are arrangedon the impeller; and a sawtooth shape 10 is adopted at the tail edge of the contraction section of an exhaust port.

The invention discloses a helical packaging structure of a light-emitting semiconductor chip and a light-emitting semiconductor light source device thereof. The helical packaging structure mainly comprises a cylindrical body, two conductive electrodes and a plurality of light-emitting semiconductor chips, wherein the cylindrical body and the two conductive electrodes are fixedly and integrally installed; the side wall of the cylindrical body is also provided with two helical insulation bars which are encircled on the side wall of the cylindrical body in parallel and divide the side wall of the cylindrical body into two relatively independent helical packaging surfaces, i.e. an anode packaging surface and a cathode packaging surface, wherein the anode packaging surface is electrically conducted with one conductive electrode, and the cathode packaging surface is electrically conducted with the other conductive electrode; and the light-emitting semiconductor chips are adhered to the anode packaging surface and the cathode packaging surface in an encircling manner and electrically connected to the two conductive electrodes in the manner of series connection and / or parallel connection. In the invention, more light-emitting semiconductor chips can not only be adhered to a smaller size, but also more uniform light-emitting arcs of 360 DEG can be obtained.

Disclosed are a synchronous motor having reduced torque pulsation while having a high torque and a system for driving a synchronous motor. Specifically disclosed is a synchronous motor which comprises a rotor (2) and a stator(3), and U-phase windings (91; 91a, 91b, and the like), V-phase windings (92; 92ab and the like), and W-phase windings (93; 93ac and the like) are wound around stator yoke portions each located between two adjacent stator teeth (7; 7a, 7ab, and the like). Each of the windings is wound in predetermined turns and in a predetermined direction such that timing differences between the timings at which a magnetic field generated at each of the stator teeth is maximized and those at which portions (10, 11, 11, and the like) between magnetic poles pass the stator teeth while the rotor (2) rotates, the timing differences being caused by a difference between the interval between the magnetic poles and that between the stator teeth, are compensated.

The invention provides a gas detection alarm device which comprises acquisition devices. The acquisition devices are arranged in an underground environment and are used for acquiring various environmental parameters in real time, and output ends of the acquisition devices are connected with input ends of a microprocessor by wires; output ends of the microprocessor are respectively connected with an alarm device and a power switch used for controlling underground power supply circuits; a relay router is interactively connected with the microprocessor, and underground information is wirelessly transmitted to an upper computer of a ground monitoring center by the relay router. The gas detection alarm device has the advantages that serious accidents of gas combustion and explosion can be fundamentally greatly reduced owing to the audible and visual alarm actions of the alarm device and the power-off action of the power switch; the information is wirelessly transmitted via the relay router, so that an underground condition can be effectively known and controlled via the upper computer of the ground control center.

A semiconductor storage apparatus having an SRAM memory cell of a low power consumption type which can reduce a wiring length of a bit line. NMOS transistors N1, N3 and N4 are formed in a P well region PW0, NMOS transistors N2, N5 and N6 are formed in a P well region PW1 and a wiring direction (a second direction) of bit lines BL1 and BL2 (bit lines BL12 and BL22) is set to be orthogonal to a direction of separation arrangement (a transverse direction in the drawing; a first direction) of the P well regions PW0 and PW1. The P well region PW0 and the P well region PW1 are formed opposite to each other with an N well region interposed therebetween.

The invention relates to an intelligent monitoring system for a wind power blade assembly mold. The intelligent monitoring system comprises a sensor, a signal acquisition and transmission system and acontrol system; the sensor comprise a plurality of vacuum degree sensors, a temperature sensor and a plurality of laser displacement sensors, and the laser displacement sensors are used for detectingthe width of a mold closing joint and the axial and chordwise dislocation degree of the mold closing joint; the multiple vacuum degree sensors are respectively installed on vacuumizing pipelines at the rear edge of an upper mold and the rear edge of a lower mold; the temperature sensor comprises a plurality of thermal resistors pre-buried in the surfaces of the upper mold and the lower mold, andthe thermal resistors are uniformly distributed on the whole surfaces of the upper mold and the lower mold; and the upper mold and the lower mold are divided into a plurality of areas, each area is provided with a data acquisition module, each data acquisition module is used for acquiring sensor data of the area nearby and sending the sensor data to an upper computer of the control system, and theupper computer monitors and displays the sensor data in real time. Parameters of the molds are fed back comprehensively, centrally and online, and the production efficiency and the product quality are improved.

The invention provides a synchronous motor in which the share of space for a coil winding wound on a stator core through a bobbin is improved. A stator core (26) is dividably assembled to the axial opposite sides of a bobbin (29) having a coil winding (28) wound thereon.

The invention relates to an X-structure Steiner tree construction method considering a voltage conversion rate. The method comprises the following steps: S1) generating an initial Steiner tree structure; s2) pre-processing and memorizing information between the pin and the obstacle; s3) optimizing the Steiner tree structure by adopting a discrete particle swarm optimization algorithm, and obtaining the optimized Steiner tree structure through a particle updating process including speed updating, self-sensing and group sensing; s4) locally optimizing the Steiner tree structure to optimize the local structure of the Steiner tree structure so as to further shorten the wiring length; and S5) adjusting the constraint violating part in the Steiner tree structure through a hybrid correction strategy, so that the Steiner tree meets the voltage conversion rate constraint, and the final Steiner tree structure is obtained.The method is beneficial to optimizing the wiring length while meeting thevoltage conversion rate constraint.

The invention discloses a planar array microwave antenna for a traffic signal detection radar. The planar array microwave antenna is formed in such a way that a group of 12 plane antenna units are connected in series and then connected in parallel with an other group of 12 series-connected plane antenna units, wherein the two groups of series-connected and parallel-connected planar array antennae are fed in an end feed way, and each planar array antenna is fed in a notch way. The invention completely meets the requirements on double-beam microwave traffic information acquisition radar, is more beneficial to the arrangement of the integral structure of the radar due to the end feed way, can reduce the wiring length of a radar receiving and transmitting assembly and is beneficial to reducing the loss of microwave radiation and the cross sectional area of the radar.

The invention provides a semiconductor packaging structure, which comprises a substrate, a first chip, a first lead, a second adhesion layer, a second chip, a second lead, a first packaging body, a second packaging body and a conducting element, wherein the substrate is provided with a front and a back, and is also provided with an opening penetrating the substrate; the first chip is provided withan active surface and a back, covers the opening through a first adhesion layer in a mode that the active surface is upwards, and is attached to the back of the substrate through the first adhesion layer; the first lead is electrically connected with the first chip and the front of the substrate through the opening; the second adhesion layer coats the first lead and covers a solder pad on the active surface of the first chip and partial front of the substrate; the second chip is provided with an active surface and a back, the back of the second chip is downwards and the active surface is upwards relative to the first chip, and the second chip is attached to the front of the substrate through the second adhesion layer; the second lead is electrically connected with the active surface of the second chip and the front of the substrate; the first packaging body coats the first chip, the first adhesion layer, the first lead and partial back of the substrate; the second packaging body coststhe second chip, the second adhesion layer, the second lead and the partial front of the substrate; and the conducting element is arranged on the back of the substrate.

A semiconductor device has: a radiator plate that is maintained at a predetermined potential; an SOI (Silicon On Insulator) chip mounted on the radiator plate; and thermal grease applied to an interface between the radiator plate and the SOI chip. The SOI chip has: a first silicon substrate forming a circuit element part; a second silicon substrate facing the radiator plate; and an insulating film formed between the first silicon substrate and the second silicon substrate. The first silicon substrate and the second silicon substrate are electrically connected to each other. The thermal grease is conductive and electrically connects the second silicon substrate and the radiator plate.

The invention provides a package structure and a method for fabricating the same. The package structure includes a substrate, wherein the substrate has a first surface and a second surface, and a first pattern metal layer is formed on the first surface, and a second patterned metal layer is formed on the second surface, and the substrate has a plurality of vias formed therein, wherein the first patterned metal layer is electrically connected to the second patterned metal layer through the plurality of vias, and the widths of the plurality of vias are gradually increased from the first surface to the second surface; a chip formed on the first surface of the substrate; and a molding material is formed on the substrate and the chip, wherein the chip is covered by the molding material. According to the invention, better electric performances can be obtained.

The invention discloses a vehicle-mounted navigation system mounting structure and an engineering machine, and belongs to the field of engineering machinery. The mounting structure comprises a vehicle-mounted navigation system and a mounting seat, wherein the vehicle-mounted navigation system comprises a radio station and a GNNS receiver, the GNNS receiver is internally provided with a directionalantenna and a positioning antenna, the mounting seat is provided with a mounting surface which is higher than the top of a vehicle, the mounting surface is provided with through holes for wiring, theradio station and the GNNS receiver are both fixedly mounted on the mounting surface, and wiring harnesses undergo wiring through the through holes. According to the mounting structure and the engineering machine, the directional antenna and the positioning antenna are arranged inside the GNNS receiver, other objects can be prevented from mistakenly touching the directional antenna and the positioning antenna, the installation process is simplified, the horizontal height of the whole mounting seat is low, the horizontal shaking amplitude of the vehicle-mounted navigation system can be reduced, the navigation precision is improved, the vehicle-mounted navigation system is mounted at the top of a cab and is closer to an electric control cabinet in the cab, the wiring length can be reduced,and the cost is reduced. The invention further discloses the engineering machine using the mounting structure.

The present invention provides an electrolytic water generating device and a sterilization system. In the electrolytic water generating device which electrolyzes water for generating electrolyzed water, a circuit part which supplies the power for electrolysis is set to a state that the entering of water or electrolyzed water is prevented, the maintenance is excellent and the wiring is facilitated.The following components are accommodated in a box (50): a water tank (51), an electrolysis unit (52) which electrolyzes the water in the water tank (51) for generating the electrolyzed water, a water feeding pump (53) for feeding the electrolyzed water to the outside, and an electric device box (30) which accommodates a power circuit part (33) that supplies water for the electrolysis unit (52) and the water feeding pump (53), wherein the electric device box (30) is fixed with a state that the electric device box (30) is suspended in the midair from a bottom surface (50D) of the box (50). Thewater feeding pump (53) is configured below the electric device box (30).