Printed-circuit board, and method for manufacturing the same

A technology of printed circuit board and manufacturing method, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., to achieve the effect of ensuring the reliability of connection

Inactive Publication Date: 2009-01-28
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in such Figure 17 In the structure shown in (A), it can be seen that when the IC chip is mounted, as Figure 17 As shown in (B), the solder constituting the small-diameter opening solder bump 78S flows out toward the pad 92 side of the IC chip 90, causing disconnection between the pad 92 of the IC chip and the pad 158 of the printed wiring board.

Method used

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  • Printed-circuit board, and method for manufacturing the same
  • Printed-circuit board, and method for manufacturing the same
  • Printed-circuit board, and method for manufacturing the same

Examples

Experimental program
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no. 1 Embodiment

[0045] Solder ball loading device

[0046] refer to Figure 14 A solder ball mounting device for mounting tiny (diameter less than 200 μm) solder balls 77 on connection pads of a multilayer printed wiring board will be described.

[0047] Figure 14 (A) is a configuration diagram showing the structure of a solder ball mounting device according to an embodiment of the present invention, Figure 14 (B) means viewed from the arrow B side Figure 14 A side view of the solder ball loading device in (A).

[0048] The solder ball mounting device 100 has an XYθ suction table 114, a vertical movement shaft 112, a ball arrangement mask 16, a mounting cylinder (tube member) 124, a suction box 126, a ball removal cylinder 161, an absorption box 166, a ball removal suction device 168, Mask fixture 144, moving shaft 140, moving shaft supporting guide rail 142, calibration camera 146, residual amount detection sensor 118, solder ball supply device 122; The XYθ suction table 114 is rai...

no. 2 Embodiment

[0118] Next, a multilayer printed wiring board and a method of manufacturing a multilayer printed wiring board according to a second embodiment of the present invention will be described with reference to FIGS. 15 and 16 .

[0119] Referring to FIGS. 10 and 11 , as described above, only the high small-diameter solder bump 78S is planarized. In this regard, in the second embodiment, as shown in FIG. 15 , the flat plate 80 is pressed against the lower height of the large-diameter solder bump 78P and the higher height of the small-diameter solder bump 78S, so that the small-diameter opening 71S The higher solder bump 78S and the solder bump 78P of the large-diameter opening 71P are flattened so that they have the same height (H2≈30 μm) (FIG. 11), and the large-diameter solder bump 78P is formed on a large-diameter (D1= φ105 μm) opening 71P, the small-diameter solder bump 78S is formed at the small-diameter (D2 = φ80 μm) opening 71S. In addition, the solder bump 78P and the solde...

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Abstract

Provided is a method for manufacturing a printed-circuit board, which can form bumps at substantially identical heights on connection pads having different opening diameters of a solder resist. Diametrically-small bumps (78S), which are made high of solder balls (77) mounted in diametrically-small openings (71S) of a solder resist layer (70), are flattened to have the same height as that of the solder bumps (78P) of diametrically-large openings (71P). The solder bumps (78S) of the diametrically small openings (71S) and the solder bumps (78P) of the diametrically large openings (71P) are identical in the solder quantity. No connection occurs at the solder bumps (78S) of the diametrically small openings (71S) so that the connection reliability between an IC chip (90) and a multilayer printed-circuit board (10) can be retained.

Description

technical field [0001] The present invention relates to a printed wiring board applicable to a packaging substrate for mounting IC chips, and a method for manufacturing the printed wiring board. The packaging substrate is composed of a build-up multilayer printed wiring board. Background technique [0002] Solder bumps are used to electrically connect the package substrate and the IC chip. Solder bumps are formed by the following steps. [0003] (1) Solder is printed on the connection pads formed on the package substrate. [0004] (2) Solder balls are mounted on the connection pads on which the flux is printed. [0005] (3) Perform reflow soldering to form solder bumps from solder balls. [0006] After forming the solder bumps on the package substrate, the IC chip is mounted on the solder bumps, and the solder bumps are connected to pads (terminals) of the IC chip by reflow soldering, thereby mounting the IC chip on the package substrate. In mounting the solder balls on ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/12H01L21/60H05K3/34
CPCH01L2924/01023H05K3/3457H01L21/4853H01L2924/0105H01L2924/01082H05K2201/094H01L2924/01004H01L2224/81801H01L2924/30105H01L2924/01019H01L2924/01029H01L2924/014H01L2924/01084H01L2924/0103H05K2203/043H01L24/81H01L2924/01047H01L2224/11334H05K3/3436H01L2924/01079H05K3/3478H05K2203/041H05K2203/0278H01L2924/14H01L2924/01033H01L2924/01005H01L2924/01006H01L2224/81192H01L2924/01078H01L2224/16225H01L2224/0554H01L2224/05568H01L2224/05573H01L2924/00014H01L2924/12042Y10T29/49121Y10T29/49142Y10T29/49144Y10T29/49149Y10T29/49167H01L2924/00H01L2224/05599H01L2224/0555H01L2224/0556H05K3/40
Inventor 丹野克彦川村洋一郎
Owner IBIDEN CO LTD
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