Helical packaging structure of light-emitting semiconductor chip and light-emitting semiconductor light source device thereof

Abstract

The invention discloses a helical packaging structure of a light-emitting semiconductor chip and a light-emitting semiconductor light source device thereof. The helical packaging structure mainly comprises a cylindrical body, two conductive electrodes and a plurality of light-emitting semiconductor chips, wherein the cylindrical body and the two conductive electrodes are fixedly and integrally installed; the side wall of the cylindrical body is also provided with two helical insulation bars which are encircled on the side wall of the cylindrical body in parallel and divide the side wall of the cylindrical body into two relatively independent helical packaging surfaces, i.e. an anode packaging surface and a cathode packaging surface, wherein the anode packaging surface is electrically conducted with one conductive electrode, and the cathode packaging surface is electrically conducted with the other conductive electrode; and the light-emitting semiconductor chips are adhered to the anode packaging surface and the cathode packaging surface in an encircling manner and electrically connected to the two conductive electrodes in the manner of series connection and / or parallel connection. In the invention, more light-emitting semiconductor chips can not only be adhered to a smaller size, but also more uniform light-emitting arcs of 360 DEG can be obtained.

Description

technical field [0001] The invention relates to the field of light emitting semiconductor chip packaging, in particular to a light emitting semiconductor chip spiral packaging structure and a light emitting semiconductor light source device. Background technique [0002] As we all know, light-emitting semiconductor chips must be packaged in a packaging structure, and electrodes are drawn out for users to connect to a power supply to make them work or emit light. In order to overcome the disadvantages of low luminous power and low brightness of traditional light-emitting diodes made of a single low-power light-emitting semiconductor chip, the Chinese inventions with the notification numbers CN100505245C and CN100454536C disclose "Light-emitting semiconductor chip packaging structure and light source device" It includes a columnar body and a plurality of light-emitting semiconductor chips. The columnar body is in the shape of a triangular column, a quadrangular column, or a po...

AI Technical Summary

Problems solved by technology

In order to overcome the disadvantages of low luminous power and low brightness of traditional light-emitting diodes made of a single low-power light-emitting semiconductor chip, the Chinese inventions with the notification numbers CN100505245C and CN100454536C disclose "Light-emitting semiconductor chip packaging structure and light source device" It includes a columnar body and a plurality of light-emitting semiconductor chips. The columnar body is in the shape of a triangular column, a quadrangular column, or a polygonal column. There are multiple axially extending insulating layers on it to separate the columnar body into multiple conductors. The periphery of the conductors forms a package surface, multiple light-emitting semiconductor chips are attached to the packaging surface

Although the columnar body with this structure can package more light-emitting semiconductor chips in a smaller volume, due to the limitation of the structure of the columnar body itself and the axial extension and division method adopted by the insulating layer, it is impossible to attach the light-emitting semiconductor chips. Attached to any point in the 360° circumferential direction of the side wall of the entire columnar body, it is difficult to obtain a uniform light-emitting arc with a range of up to 360° for the packaged semiconductor package structure

In addition, since the packaging surface of this columnar body is a planar structure, if you want to improve the uniformity of the light arc, you need to ensure that the light-emitting semiconductor chip is attached to the center of the packaging surface, and the volume of the light-emitting semiconductor chip and the columnar body is small. Accurate positioning will inevitably increase the difficulty of the process, reduce production efficiency, and increase production costs

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