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Array substrate and manufacturing method thereof, and display device

An array substrate and manufacturing method technology, applied in the field of array substrates with a copper wire structure, can solve the problem that the channel size cannot be effectively reduced

Active Publication Date: 2013-02-13
INNOCOM TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, wet etching is generally used for copper wires, which is prone to undercutting 120 during etching, which leads to the inability to effectively reduce the channel size of TFTs.

Method used

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  • Array substrate and manufacturing method thereof, and display device
  • Array substrate and manufacturing method thereof, and display device
  • Array substrate and manufacturing method thereof, and display device

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Embodiment Construction

[0017] The present invention will provide many different embodiments to implement different features of the present invention. The composition and configuration of each specific embodiment will be described below to simplify the present invention. These are examples and do not limit the present invention. In addition, repeated element symbols may appear in various examples in this specification to simplify the description, but this does not mean that there is any specific relationship between the various embodiments and / or illustrations. In addition, "above", "on", "under" or "on" a first element formed on a second element may include that the first element is in direct contact with the second element in the embodiment, or may also include There are other additional elements between the first element and the second element so that the first element and the second element do not directly contact.

[0018] The copper wire structure provided by the embodiment of the present inv...

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Abstract

The embodiment of the invention discloses an array substrate and a manufacturing method thereof, and a display device with the array substrate. The array substrate comprises a substrate body, an insulating layer, a semiconductor layer, a metal layer and a copper wire, wherein a wire is arranged on the substrate body; the insulating layer covers the substrate body and the wire; the semiconductor layer is arranged on the insulating layer and overlapped with the wire; the metal layer comprises a first part and a second part which cover the two sides of the semiconductor layer respectively; and the copper wire is formed on the first part of the metal layer and is not overlapped with the semiconductor layer.

Description

technical field [0001] The invention relates to an array substrate and a manufacturing method thereof, in particular to an array substrate with a copper wire structure. Background technique [0002] Generally speaking, a thin film transistor (hereinafter referred to as TFT for short) is an active device used in an array substrate. Array substrates are used to manufacture display devices. The array substrate generally includes a plurality of pixels divided by a plurality of gate lines and data lines, and each pixel includes a TFT connected with the gate lines and data lines. The TFT is used as a switch to determine whether to allow the signal transmitted by the data line to enter the pixel according to the scanning gate voltage applied to the gate electrode. A general TFT is formed of a gate electrode, an active layer, and source / drain electrodes. [0003] As the size of the display device becomes larger and the required resolution becomes higher, it is necessary to provid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77G02F1/1362G02F1/1368
Inventor 周政旭
Owner INNOCOM TECH SHENZHEN