Suction nozzle, chip mounter with suction nozzle and mounting method of chip mounter
A placement machine and placement technology, which is applied in the direction of assembling printed circuits with electrical components, can solve problems such as collapse, lower production efficiency, chip fragmentation, etc., to avoid damage, ensure placement speed, and improve product yield Effect
Active Publication Date: 2015-05-06
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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- Description
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Problems solved by technology
However, with the further increase of the density of integrated circuits, there are often critical parts such as circuits or air bridges on the edge of the bare chip, and the edge of the nozzle is flat and has no buffer function. When the suction nozzle touches the bare chip with a large impact force, the chip will be broken and the suction nozzle will be damaged. The flat edge may collapse the air bridge at the edge of the bare chip, which will cause trouble to the equipment user, reduce production efficiency, and affect product reliability
Method used
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[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0033] The placement machine provided by the embodiment of the present invention is used to absorb the bare chip to be mounted in the adsorption packaging box, and then place the bare chip to be mounted at the position to be mounted so as to facilitate mounting and improve the accuracy of mounting Rate. In this embodiment, the process of absorbing the bare chip to be mounted in the adsorption box will be described in detail.
[0034] Please also refer to figure 1 and figure 2, the mounter includes a host 14, a mounting head fixed on the host 14, and a suction nozzle 8 installed on the mounting ...
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The invention discloses a suction nozzle, a chip mounter with the suction nozzle and a mounting method of the chip mounter. The suction nozzle is installed on the chip mounter and is used for sucking a bare chip to be mounted, the suction nozzle comprises a sucking disk and a suction nozzle vacuum channel which is arranged on the outer surface of the bottom of the sucking disk, the suction nozzle vacuum channel penetrates into the bottom of the sucking disk to be communicated with the inside of the sucking disk, and at least one nick is formed on the edge of the sucking disk. Accordingly, nicks are formed on the suction nozzle, so that the impact force damaging the bare chip, which is caused by the fact that the suction nozzle is in contact with key parts such as the bare chip and an air bridge, is avoided and the damage for the chip is avoided.
Description
technical field [0001] The invention relates to a placement machine with a suction nozzle and a placement method of the placement machine. Background technique [0002] In the bare chip placement process of high-density integrated circuits, the placement process is that the placement machine sucks the bare chip from the GEL-PAK box through the suction nozzle at the end of its placement head and brings it to the substrate to be placed. in the correct position. [0003] The suction nozzle is usually a flat and smooth contact surface with a front end, and a hole is opened in the center, which is connected to the vacuum air channel through the suction nozzle mounting base. It is then placed on the correct position on the substrate and pressed tightly, the vacuum is released, and the chip is blown off. However, with the further increase of the density of integrated circuits, there are often critical parts such as circuits or air bridges on the edge of the bare chip, and the edg...
Claims
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IPC IPC(8): H05K3/30
Inventor 宋夏邱颖霞林文海赵丹刘炳龙
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST