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Unit circuit board replacement method of circuit board and product sheet of circuit board

A circuit board and circuit board technology, which is applied in the field of unit circuit board replacement of circuit boards and finished products of circuit boards, can solve problems such as rising cost of circuit boards, and achieve the effects of improving productivity, suppressing flow, and improving support stability

Active Publication Date: 2017-03-01
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method, if there is even one unqualified unit circuit board on the product sheet, the entire product sheet must be discarded, that is, the entire product sheet containing a plurality of qualified unit circuit boards must be discarded, which constitutes the basis for circuit board production. The main reason for the rising cost

Method used

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  • Unit circuit board replacement method of circuit board and product sheet of circuit board
  • Unit circuit board replacement method of circuit board and product sheet of circuit board
  • Unit circuit board replacement method of circuit board and product sheet of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. figure 1 It is a plan view showing the product sheet 1 of the circuit board of the laminated board of this embodiment. The product sheet 1 is composed of a unit circuit board 2 of a multilayer structure as a product forming part; a shell-shaped waste part 3 provided on the outer periphery of the unit circuit board 2; A plurality of joint parts 4, 4 ... constituted by connecting a plurality of parts of the body. On the component mounting portions 5, 5 provided oppositely on the unit circuit board 2, electronic components and the like are automatically mounted by an inserter or the like.

[0101] Specifically, the product shape of the unit circuit board 2 is formed by punching out predetermined parts of the product shape other than the joint portions 4 , 4 . . . of the product sheet 1 . The punched part S generated at this time is used as a boundary area, ...

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PUM

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Abstract

PROBLEM TO BE SOLVED: To raise efficiency and quality in improving quality of a product sheet by fitting and securing a sound piece into a place of a product sheet where a defective piece has been removed, by a simple technology with high precision in a strong manner.SOLUTION: In a case where a defective piece 2B is present in a product sheet 1, an outer layer part removal portion 17 around a joint part 4 of a scrap part 3 is punched out, and at the same time, a tapered recess 13 is formed at the outer layer part removal portion 17, so that the defective piece 2B containing the joint part 4 is separated and removed from the product sheet 1. Then, a sound piece 2A with the joint part 4 having a tapered protruding part 18 that can engage with the recess 13 on the scrap part 3 side is arranged at a place from which the defective piece has been removed. The protruding part 18 of the sound piece 2A is engaged with the recess 13 on the scrap part 3 side and connected each other, after that, both surfaces and / or a single surface of the connection part is fixed by using a reinforcing film 15.

Description

technical field [0001] The present invention relates to the unit circuit board replacement method and the circuit substrate of the circuit substrate of the unit circuit board on the product sheet, and the present invention particularly relates to replacing the unqualified unit circuit board inside the product sheet with a qualified unit circuit board to form a qualified unit circuit board. The unit circuit board replacement method of the circuit substrate of the product sheet and the product sheet of the circuit substrate. Background technique [0002] At present, in the past, various countermeasures have been proposed, and various countermeasures have been reported for the case where a defective unit board exists in a circuit board composed of a plurality of unit boards. For example, the following technology is disclosed. In the circuit board on which a plurality of unit circuit boards are planarly mounted on the same product sheet, when there is a defective unit circuit bo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/22
Inventor 上总佳久
Owner NIPPON MEKTRON LTD
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