A process chamber exhaust system and exhaust method

Abstract

The invention provides a technology chamber air exhaust system and an air exhaust method. The technology chamber air exhaust system comprises at least one air exhaust unit, a main air exhaust pipeline and a controller. The air exhaust unit comprises a technology chamber, an air exhaust branch pipe, a regulating valve, a motor and a differential manometer, wherein the regulating valve is mounted in the air exhaust branch pipe, the controller is connected with the differential manometer and the motor, the motor is connected with the regulating valve, an inlet of the air exhaust branch pipe is connected with the technology chamber, and an outlet of the air exhaust branch pipe is connected with the main air exhaust pipeline. When the technology chamber air exhaust system is used for exhausting air, the regulating valve in the air exhaust branch pipe is driven by the motor so that the opening degree of the regulating valve can be controlled, automatic adjustment of the exhaust air rate is achieved, and therefore an airflow field in the technology chamber is adjusted. The technology chamber air exhaust system can flexibly change the airflow field in the technology chamber, reduce secondary pollution to chips to be disposed caused by liquid drops, generated particles and the like in a technological process, and enable technological processing effect of the chips to be improved remarkably.

Description

technical field [0001] The invention relates to the field of micro-environment exhaust air inside integrated circuit manufacturing equipment, in particular to an exhaust system and an exhaust method for a process chamber. Background technique [0002] With the rapid development of integrated circuit manufacturing technology, the current mainstream technology has transitioned from 90nm to 65nm, 45nm or even below ultra-fine integrated circuit manufacturing. This means that the feature size of the integrated circuit chip has entered the deep sub-micron stage, and the feature size of the key particles that cause the failure or damage of the ultra-fine circuit on the chip has also been greatly reduced. It is the airflow field in the micro-environment inside the process chamber that puts forward stricter requirements to avoid secondary pollution of the processed wafers by droplets and particles generated during the process. [0003] Usually, a fan filter unit FFU (FanFilterUnit)...

AI Technical Summary

Problems solved by technology

However, the existing integrated circuit manufacturing equipment adopts manual adjustment for the exhaust device at the bottom of the process chamber, and the opening of the valve in the exhaust device is fixed, so the exhaust air volume cannot be automatically adjusted according to different process steps, and cannot be flexibly adjusted. Changing the airflow field inside the process chamber

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