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In-place management of semiconductor equipment recipes

A recipe and redistribution technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, measurement devices, etc., which can solve the problem of expensive data transmission overhead

Active Publication Date: 2013-03-20
KLA TENCOR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the case of a distributed optical defect inspection system that includes multiple inspection tools accessing single-component libraries, the data transfer overhead associated with the movement of these large files can become expensive

Method used

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  • In-place management of semiconductor equipment recipes
  • In-place management of semiconductor equipment recipes
  • In-place management of semiconductor equipment recipes

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Embodiment Construction

[0020] In the following detailed description of exemplary embodiments, reference is made to the drawings forming a part thereof. In the several drawings, similar reference numerals identify similar elements. The detailed description and drawings illustrate exemplary embodiments. Other embodiments may be utilized, and other changes may be made without departing from the spirit or scope of the subject matter presented herein. Therefore, the following detailed description is not intended to be limiting, and the scope of the claimed subject matter is defined by the appended claims.

[0021] In order to minimize the transmission of large optical target component data files, these files can be maintained in data storage outside the central processing unit, and transmitted across the peer-to-peer network in an on-demand manner under the guidance of the central processing unit.

[0022] Now, specific reference will be made to the disclosed subject matter shown in the drawings.

[0023] re...

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Abstract

Systems and methods for managing optical inspection target components are disclosed. A method may include, but is not limited to: storing at least one external recipe component at an inspection tool node; associating at least one proxy component with the at least one external recipe component; associating the at least one external recipe component with at least one optical inspection target recipe; and storing the at least one optical inspection target recipe including the at least one proxy component in a recipe distribution server. A method may include, but is not limited to: receiving a selection of at least one recipe associated with an optical inspection target to be inspected at a first inspection tool node; and determining whether one or more external recipe components associated with the recipe are stored on at least one of the first inspection tool node and a second node.

Description

Background technique [0001] In optical defect inspection (for example, semiconductor inspection process), the system may include information about the design specifications of each structural component (for example, the threshold distance between alignment marks) of the optical inspection target (for example, semiconductor device) database. For a specific optical inspection target, the system can maintain recipe data reflecting a combination of multiple structural components selected from the component database, and these structural components are combined to create the optical inspection target. The recipe can include all the information needed to perform an inspection or classify defects related to the optical inspection target. [0002] For example, in order to improve inspection quality, high-resolution image data associated with the correct optical target design can be maintained so that the data can be compared with inspection data associated with the optical target during ...

Claims

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Application Information

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IPC IPC(8): H01L21/66
CPCH01L21/00G01N21/9501G06Q10/06H01L21/02H01L21/67276H01L22/12
Inventor D·G·戴维C·W·李
Owner KLA TENCOR CORP