Multipath transparent transmission method and switching chip
A switching chip, multi-path technology, applied in data switching networks, transmission systems, digital transmission systems, etc., can solve the waste of bandwidth on the backplane side, the N value cannot be made too large, and limit the application of fullmesh-N backplane switching systems And other issues
Active Publication Date: 2016-01-27
HUAWEI TECH CO LTD
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
This leads to the obvious waste of bandwidth on the backplane side of the fullmesh-N backplane switching system
In addition, when the N value of the fullmesh-N structure is large, since the fullmesh-N backplane switching system has a large number of slots, the total bandwidth of the backplane side required by a single switching chip will also be large. Due to the constraints on the realizability of the total bandwidth on the backplane side of the switch chip, the N value of the fullmesh-N backplane switching system cannot be made too large, thus limiting the application of the fullmesh-N backplane switching system
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0070] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0071] figure 2 A flow chart of a multi-path transparent transmission method provided by an embodiment of the present invention is given, as shown in figure 2 As shown, the multipath transparent transmission method provided in this embodiment includes:
[0072] 201. The first switch chip determines whether the direct transmission traffic ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
An embodiment of the invention provides a multipath pass-through method and a switching chip. Transmitting end chips can be used to send excess flows to other switching chips under the circumstance that flows transmitted on a directly-connected path between the transmitting end chips and target switching chips reach the bandwidth of the directly-connected path, and other switching chips pass the excess flows to the target switching chips, accordingly, the switching chips in the system can transmit data to the target switching chips through a bandwidth surpassing the bandwidth between the switching chip and target switching chips.
Description
technical field [0001] The invention relates to the technical field of backplane switching, in particular to a multipath transparent transmission method and a switching chip. Background technique [0002] Currently, a fullmesh-N backplane switching system with N slots usually uses the direct transmission method to transmit data. When traffic needs to be sent from one of the N slots to another slot, the traffic Passed only in the direct high-speed signal traces between the switch chips in these two slots. Such as figure 1 As shown, taking the fullmesh-4 backplane switching system as an example, when the system needs to send data from the slot 101a to the slot 101b, the data traffic can only be transmitted between the switch chip 103a and the switch chip 103a in the line card 102a of the slot 101a Signals are transmitted between the switch chips 103b in the line card 102b of the slot 101b. When the exchange chip 103a in this system transmits data to the exchange chip 103b f...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H04L12/931H04L12/801
Inventor 丁超
Owner HUAWEI TECH CO LTD