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Acrylic resin/organosilicon hybrid composite electronic potting adhesive and preparation method thereof

An acrylic resin, hybrid composite technology, applied in the direction of adhesives, adhesive types, grafted polymer adhesives, etc., can solve the problem of poor comprehensive performance and lack of corrosion resistance of organic-inorganic hybrid electronic potting adhesives and other problems, to achieve good impact resistance, not easy to phase separation, and good compatibility

Active Publication Date: 2015-02-25
GUANGZHOU GLORYSTAR CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, some studies have found that the comprehensive performance of organic-inorganic hybrid electronic potting adhesives prepared by a single sol-gel method is not good enough, and some of them are still lacking in corrosion resistance. Therefore, it is necessary to find a preparation method. A way to develop a hybrid composite electronic potting compound with excellent and balanced comprehensive properties

Method used

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  • Acrylic resin/organosilicon hybrid composite electronic potting adhesive and preparation method thereof
  • Acrylic resin/organosilicon hybrid composite electronic potting adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] An acrylic resin / organic silicon hybrid composite electronic potting glue, which is prepared by the following preparation steps:

[0026] (1) Add 60 parts by weight of isopropanol and 5 parts by weight of distilled water into a clean reaction device, stir and raise the temperature. When the temperature rises to 45°C, slowly add 20 parts by weight of tetramethoxysilane dropwise to it (TMOS), then dropwise add an acid catalyst that is composed of hydrochloric acid and hydrofluoric acid in a mass ratio of 8:0.5, until the pH value is 4, after the dropwise addition is completed, it is incubated for 0.5h;

[0027] (2) After that, the temperature was raised to 65°C, and after continuing to react for 2 hours, 2 parts by weight of dodecafluoroheptyltrimethoxysilane was added dropwise under stirring, kept warm, stirred and refluxed for 2 hours, and hybrid silica sol A was obtained;

[0028] (3) 2 parts by weight of deionized water, 70 parts by weight of hybrid silica sol A and 0...

Embodiment 2

[0031] An acrylic resin / organic silicon hybrid composite electronic potting glue, which is prepared by the following preparation steps:

[0032] (1) Add 90 parts by weight of isopropanol and 20 parts by weight of distilled water into a clean reaction device, stir and raise the temperature. When the temperature rises to 55°C, slowly add 40 parts by weight of tetramethoxysilane dropwise to it (TMOS), then dropwise add an acid catalyst that is composed of hydrochloric acid and hydrofluoric acid in a mass ratio of 8:2, until the pH value is 5, after the dropwise addition is completed, it is incubated for 2h;

[0033] (2) After that, the temperature was raised to 80°C, and after continuing to react for 3 hours, 10 parts by weight of dodecafluoroheptyltrimethoxysilane was added dropwise under stirring, kept warm, stirred and refluxed for 4 hours, and hybrid silica sol A was obtained;

[0034](3) 10 parts by weight of deionized water, 95 parts by weight of hybrid silica sol A and 1 p...

Embodiment 3

[0037] An acrylic resin / organic silicon hybrid composite electronic potting glue, which is prepared by the following preparation steps:

[0038] (1) Add 80 parts by weight of isopropanol and 15 parts by weight of distilled water into a clean reaction device, stir and raise the temperature. When the temperature rises to 50°C, slowly add 30 parts by weight of tetramethoxysilane dropwise to it (TMOS), then dropwise add an acid catalyst that is composed of hydrochloric acid and hydrofluoric acid in a mass ratio of 8:1.5, until the pH value is 4.5, after the dropwise addition is completed, it is incubated for 1h;

[0039] (2) After that, the temperature was raised to 70°C, and after continuing to react for 2.5 hours, 7 parts by weight of dodecafluoroheptyltrimethoxysilane was added dropwise under stirring, kept warm, stirred and refluxed for 3 hours, and hybrid silica sol A was obtained;

[0040] (3) 7 parts by weight of deionized water, 85 parts by weight of hybrid silica sol A an...

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Abstract

The invention provides an acrylic resin / organosilicon hybrid composite electronic potting adhesive and a preparation method thereof. A fluoride-containing hybrid silica sol / fluoride-containing polyacrylate integrated high-performance composite electronic potting adhesive is prepared by in-situ emulsion polymerization; and the formed composite electronic potting adhesive is in a shell-core structure using fluoride-containing inorganic-organic hybrid silica sol as the core and fluoride-containing polyacrylate as the shell. The coated film formed by the shell-core structure composite electronic potting adhesive has favorable impact resistance, acid / alkali resistance, heat resistance and abrasion resistance, and also has the advantages of favorable film-forming properties, favorable blanching resistance and high storage stability. A certain amount of organosilane MEMO is introduced into the polyacrylate to further enhance the glossiness of the coated film; and the formed Si-O-Si cross-linked network has high stability and can not easily produce aggregation of large-size sol particles.

Description

technical field [0001] The invention relates to a composite hybrid silicon material, in particular to an acrylic resin / organic silicon hybrid composite electronic potting glue. Background technique [0002] Silicone material has high insulation to avoid breakdown or short circuit between circuits; it has excellent electrical insulation, high and low temperature resistance, corona resistance, ozone resistance and other properties. Because of these high performance and advantages, the application in the field of automotive electronics is particularly valued, and the application fields in automotive electronics are becoming wider and wider, such as protecting engine control modules, ignition coils and ignition modules, power system modules, Braking system modules, exhaust emission control modules, power systems, lighting systems, various sensors, connectors, etc. However, the currently prepared silicone electronic potting adhesives generally have defects such as poor film-form...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F283/12C08F2/26C08F2/30C08F4/30C08G77/24C09J151/08
Inventor 黄德裕胡新嵩赖观品余杰明陈耀根
Owner GUANGZHOU GLORYSTAR CHEM
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