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Hot pressing molding device and method thereof

A hot-press forming and hydraulic tank technology, applied in the field of hot-press forming devices, can solve the problems of multiple processing instruments, burrs and overflows, easy damage, etc., so as to reduce costs and avoid secondary processing.

Inactive Publication Date: 2013-04-17
CHENMING MOLD IND CORP
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Problems solved by technology

[0008] In view of the deficiencies of the aforementioned known technologies, the object of the present invention is to provide a thermoforming device and its method to solve the problems of the known technologies that produce burrs and flashes, resulting in multiple processing or easy damage to the instrument, and At the same time overcome the difficulties of the existing technology

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  • Hot pressing molding device and method thereof
  • Hot pressing molding device and method thereof
  • Hot pressing molding device and method thereof

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no. 1 example

[0043] According to the first embodiment, the present invention further proposes a second embodiment for further illustration.

[0044] Please refer to image 3 , which is the first schematic diagram of the second embodiment of the thermoforming device of the present invention. Such as image 3 As shown, the thermocompression molding device of the present invention may include a first mold 10 and a second mold 20, wherein the first mold 10 may include a first template 172 and a first main shell 11, and the second mold 20 may include a second template 252 And the second main shell 21. The elastic heat-conducting film 12 can be arranged on the first mold 10, and the surface edge of the first mold 10 has a first annular structure, and its first annular structure can correspond to a surface of the board to be embossed 90, so that the board to be embossed 90 has a corresponding ring structure figure after molding. Meanwhile, the upper surface of the first template 172 is provid...

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Abstract

The invention discloses a hot pressing molding device and a method thereof, comprising a first die and a second die, wherein the first die includes a first formwork and a first main housing and the second die includes a second formwork and a second main housing. The first formwork is provided with a first circular structure which is arranged on the edge of the first formwork; an upper surface of the first formwork is provided with first optical lines. The second formwork is provided with a second circular structure relative to the first formwork; the second circular structure is arranged on the edge of the second formwork; a lower surface of the second formwork is provided with second optical lines. The first die and the second die are connected to imprint panels to be imprinted to make the imprint panels possess a first circular structure or a second circular structure. According to the invention, the problem can be solved that a hot pressing molding device and a method thereof of prior arts can generate rough selvedge and flash, which may lead to multiple processing and breakdown of instruments.

Description

technical field [0001] The invention relates to a thermocompression forming device and method thereof, in particular to a thermocompression molding device and method capable of accommodating overflowing glue and avoiding overflow and burrs. Background technique [0002] The known thermocompression molding method of the Light Guide Panel (LGP) is to place the object to be imprinted in the cavity of the embossing mold. printed surface. After placing the object to be imprinted on the surface of the upper template with embossed optical textures, the imprinting mold is closed. At this time, the upper template will form a closed mold cavity, and the imprinting mold can soften the object to be imprinted to a plastic state by heating. Then, the imprinting mold is applied to the object to be imprinted, so that the embossed pattern of the upper template is formed on the object to be imprinted, and finally the object to be imprinted is cooled, so that the molded product can be taken ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C51/10B29C51/30
Inventor 庄元立邱耀弘高明哲
Owner CHENMING MOLD IND CORP
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