Thermoforming device and method thereof

A technology of hot press forming and hydraulic tank, which is applied in the field of hot press forming devices, can solve the problems of burrs and overflow, multiple processing instruments, easy damage, etc., and achieve the effect of avoiding secondary processing and reducing costs

Inactive Publication Date: 2016-06-01
CHENMING MOLD IND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In view of the deficiencies of the aforementioned known technologies, the object of the present invention is to provide a thermoforming device and its method to solve the problems of the known technologies that produce burrs and flashes, resulting in multiple processing or easy damage to the instrument, and At the same time overcome the difficulties of the existing technology

Method used

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  • Thermoforming device and method thereof
  • Thermoforming device and method thereof
  • Thermoforming device and method thereof

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no. 1 example

[0043] According to the first embodiment, the present invention further proposes a second embodiment for further illustration.

[0044] Please refer to image 3 , which is the first schematic diagram of the second embodiment of the thermoforming device of the present invention. Such as image 3 As shown, the thermocompression molding device of the present invention may include a first mold 10 and a second mold 20, wherein the first mold 10 may include a first template 172 and a first main shell 11, and the second mold 20 may include a second template 252 And the second main shell 21. The elastic heat-conducting film 12 can be arranged on the first mold 10, and the surface edge of the first mold 10 has a first annular structure, and its first annular structure can correspond to a surface of the board to be embossed 90, so that the board to be embossed 90 has a corresponding ring structure figure after molding. Meanwhile, the upper surface of the first template 172 is provid...

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Abstract

The present invention discloses a hot press molding device and a hot press molding method thereof. The hot press molding device comprises a first mould and a second mould, the first mould comprises a first template and a first main shell, the second mould comprises a second template and a second main shell. Therein, the first template disposes a first ring configuration on the edge of the first template. A first optical texture is disposed on the surface of the first template. The second template compared with the first template disposes a second ring configuration on the edge of the second template. A second optical texture is disposed on lower surface of the second template. The first mould joins to the second mould in order to a pending imprint board imprint with the first ring configuration or the second ring configuration.

Description

technical field [0001] The invention relates to a thermocompression forming device and method thereof, in particular to a thermocompression molding device and method capable of accommodating overflowing glue and avoiding overflow and burrs. Background technique [0002] In a known thermocompression forming method of a Light Guide Panel (LGP), an object to be imprinted is placed in a cavity of an imprinting mold. The imprinting mold includes upper templates, and each of the upper templates has an embossing surface for embossing optical textures. After placing the object to be imprinted on the surface of the upper template with embossed optical textures, the imprinting mold is closed. At this time, the upper template will form a closed mold cavity, and the imprinting mold can soften the object to be imprinted to a plastic state by heating. Then, the imprinting mold is applied to the object to be imprinted, so that the embossed pattern of the upper template is formed on the ob...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C51/10B29C51/30
Inventor 庄元立邱耀弘高明哲
Owner CHENMING MOLD IND CORP
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