Constraint to components with high migration rate in electric connection
A technology for electrical connections and electrical connection points, applied in circuits, welding equipment, manufacturing tools, etc., can solve problems such as cost competition, increased costs, and unsatisfactory commercial applications
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[0021] This application is related to a concurrently filed US Patent Application entitled "Recyclable Thermal Connection," the entire contents of which are hereby incorporated by reference as if fully set forth herein.
[0022] Our approach involves two aspects, each of which can be used alone or in combination with each other.
[0023] The first aspect involves the use of materials known as barriers under the joining metal, such as solder or alloys, to bind and / or attract mobile atoms in the joining metal. This is accomplished by selecting appropriate materials and by ensuring that the contact area and thickness (i.e. volume) of the barrier material is large relative to the solder or connection forming alloy (hereinafter often referred to as the "joint metal"), in the above mentioned combination In the case of columns and penetration connections as described in the application, the material will be ductile.
[0024] Alternatively, to the extent that the volume of the most mo...
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Abstract
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