Substrate unloading device and pecvd equipment with it
A technology for unloading devices and substrates, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as low work efficiency, high cost, and many control modules, so as to improve work efficiency, facilitate daily maintenance, and facilitate installation. Effect
Active Publication Date: 2015-09-02
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0004] In the above-mentioned traditional substrate unloading device, the manipulator needs to complete the process of taking the film from the substrate conveyor belt to the lifting platform, and the manipulator needs to reciprocate and the material box needs to be continuously lifted, so the work efficiency is relatively low.
In addition, the traditional substrate unloading device uses a manipulator and a lifting screw, which requires multiple conveyor belts and corresponding drive motors, and the lifting of the screw also requires servo electrodes.
There are many sensors and control modules to detect the material box, so the structure is complicated, the control is difficult, the operation is complicated, and the cost is high
Method used
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Embodiment Construction
[0023] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0024] In describing the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "horizontal", "top", "bottom" etc. indicate The orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation or be configured in a specific orientati...
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The invention discloses a substrate unloading device which comprises a first conveyer, a second conveyer and a material box, wherein the first conveyer is arranged horizontally and is used for conveying a substrate from a first end of the first conveyor to a second end of the first conveyor, a first end of the second conveyor is adjacent to and is of the same height as the second end of the first conveyor, so that the substrate which is conveyed to the second end of the first conveyor can be moved to the first end of the second conveyor, a second end of the second conveyor extends obliquely downwards along the direction far away from the second end of the first conveyer, and the material box is arranged adjacent to the second end of the second conveyor and is used for receiving the substrate conveyed to the second end of the second conveyor. The substrate unloading device is simple in structure, high in working efficiency and low in cost.
Description
technical field [0001] The present invention relates to a substrate unloading device and PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment with the substrate unloading device. Background technique [0002] In the substrate unloading device of traditional PECVD equipment, the magazine is fixed on the lead screw, and the manipulator takes the substrate (such as solar cells) from the substrate conveyor belt once at the pick-up position and then moves to the unloading position to put the substrate into the magazine. After repeated pick-and-place, the lead screw goes down to the low position after the substrate is filled with the material box, and then the material box is removed manually, but after the empty material box is replaced, the lead screw rises to the high position to continue loading. [0003] In another traditional substrate unloading device of PECVD equipment, the material box tray and the empty material box are transported to the lifting platform through ...
Claims
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IPC IPC(8): H01L21/67
Inventor 卢川
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD