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A LED integrated package module realized by transition electrode

A transition electrode, integrated packaging technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problem of chips not working, and achieve the effects of improving reliability, extending chip spacing, and improving repair rate

Active Publication Date: 2016-06-08
SHIJIAZHUANG EMPOLDER SHENTONG MACHINE ELECTRIC EMPOLDER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Using this bonding method, the LED chips are connected in series one by one to form a group. The positive and negative electrodes of the first and last two LED chips in this series group that have not participated in the bonding are respectively bonded to the designated lead positions that communicate with the input terminals of the module. The module can have multiple groups of chipsets that work in series through the leads between chips. These chipsets in the same module can work in parallel by bonding the first and last two chips of each group of chips on the same electrodes. This connection is First in series and then in parallel, when one of the chips or leads fails, such as: open circuit, all the chips on the same series group will not work; because each line needs to be bonded to two chip electrodes, the length of the lead Restrictions and constraints of bonding lead equipment, general mass production can only arrange chips into a densely packed matrix structure

Method used

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  • A LED integrated package module realized by transition electrode
  • A LED integrated package module realized by transition electrode
  • A LED integrated package module realized by transition electrode

Examples

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Embodiment Construction

[0027] Such as figure 1 , 3 , 4 and 6, in the figure D represents the LED chip, L represents the bonding lead, and G represents the transition electrode. An LED integrated packaging module realized by using transition electrodes, including LED chips 3, positive and negative electrodes 4 located on the LED chips, bonding leads 5 connected to the positive and negative electrodes on the LED chips, and transition electrodes 6. The transition electrodes 6 are located between the bonding leads 5 .

[0028] There are many ways to connect LED chips in the LED integrated package module using transition electrodes, one of which is as follows: figure 1 and 3 As shown, the LED integrated package includes more than two groups of LED strings, the LED strings are sequentially connected in series, and each group of LED strings includes more than two LED chips 3, and the LED chips 3 are connected in parallel through bonding wires 5 and transition electrodes 6. Another connection method s...

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Abstract

The invention discloses an LED integrated packaging module realized by adopting a transition electrode, and relates to the technical field of lighting devices. It includes an LED chip, positive and negative electrodes on the LED chip, and bonding wires connecting the positive and negative electrodes on the LED chip, and also includes a transition electrode, and the transition electrode is located between the bonding wires. The LED integrated packaging module reduces the maintenance difficulty of damaged components in the module, improves the repair rate and work reliability, reduces the loss of maintenance materials, and makes the arrangement distance and arrangement structure of LED chips more flexible.

Description

technical field [0001] The present invention relates to the technical field of lighting devices, in particular to an LED lighting device. Background technique [0002] At present, a common method of LED integrated packaging is that the chips are arranged on the substrate in a matrix structure. The substrate is mostly a metal substrate, and there are also ceramic substrates, ceramic-metal composite substrates, and resin-metal composite substrates. Bonding on the corresponding positive and negative electrodes of the two LED chips to realize the series circuit connection between the chips, the structure is as follows figure 2 shown. [0003] Using this bonding method, the LED chips are connected in series one by one to form a group. The positive and negative electrodes of the first and last two LED chips in this series group that have not participated in the bonding are respectively bonded to the designated lead positions that communicate with the input terminals of the module...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L25/075
CPCH01L2224/48091H01L2224/48137H01L2224/49111H01L2924/00014
Inventor 谷青博崔泽英
Owner SHIJIAZHUANG EMPOLDER SHENTONG MACHINE ELECTRIC EMPOLDER