High-density memory smart card module and manufacture method thereof

Abstract

The invention discloses a high-density memory smart card module and a manufacture method of the high-density memory smart card module. The high-density memory smart card module comprises a memory card which has functions of a general memory card and a smart card. The memory card is provided with a first data terminal, a second data terminal, a third data terminal, a fourth data terminal, a first power source terminal, a first ground terminal, a first clock terminal and an order terminal. The smart card has a function of a general subscriber identity module (SIM) card and is provided with a second power source terminal, a second ground terminal, a second clock terminal, an input / output (I / O) terminal and a reset terminal. The memory card and the smart card are arranged in the same packaging part, and at least one pair of terminals between the first power source terminal and the second power source terminal, between the first ground terminal and the second ground terminal, and between the first clock terminal and the second clock terminal respectively share the same terminal.

Description

technical field [0001] The invention relates to a high-density storage smart card module and a manufacturing method thereof, in particular to a high-density storage smart card module capable of reducing design difficulty and design space of a mobile phone circuit board and a manufacturing method thereof. Background technique [0002] In recent years, the technology of mobile phones (mobile phones) has been developed rapidly, and mobile phones usually have SIM card slots and memory card slots (for example, MicroSD card slots) for inserting SIM cards or memory cards respectively, so as to realize such functions as communication and storage functions. [0003] Usually, the SIM card slot and the memory card slot are respectively arranged on the circuit board of the mobile phone and are independent of each other. However, this traditional arrangement requires two types of card slots to be provided on the circuit board, and corresponding connection circuits need to be designed fo...

AI Technical Summary

Problems solved by technology

However, this traditional arrangement requires two types of card slots to be provided on the circuit board, and corresponding connection circuits need to be designed for the two types of card slots, so this arrangement will cause waste of space on the circuit board, and It makes the circuit on the circuit board more complicated, which is not conducive to the thinning and lightening of mobile phones

[0004] In addition, since the SIM card slot and the memory card slot are independent of each other, the current needs to pass through a larger space, resulting in increased power consumption of the mobile phone

In addition, as the frequency of communication between the main frequency of mobile phones and peripherals increases, this layout cannot meet the requirements of signal integrity.

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