Diode encapsulation method

Abstract

The invention discloses a diode encapsulation method. The diode encapsulation method comprises the following steps of: placing blanking pieces on a conveying unit, conveying the blanking pieces to a station of a first dispensing mechanism through the conveying unit and dispensing; conveying the dispensed blanking pieces to a station of a die bonding mechanism continuously through the conveying unit and finishing die bonding; conveying the blanking pieces subjected to die bonding and chips to a station of a second dispensing mechanism continuously through the conveying unit and dispensing the chips on the blanking pieces; and conveying the blanking pieces and the chips subjected to dispensing to a station of a mechanical arm mechanism continuously through the conveying unit, grabbing loading pieces by the mechanical arm mechanism and placing the loading pieces on the dispensing positions of the chips to finish the encapsulation operation of diodes. With the method, internal injury of the chips can be reduced, the consistency of the diode finished products can be improved, and the processing efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a diode packaging method. Background technique [0002] In the packaging process of the diode, it is a very important process to attach the chip between the upper and lower material sheets of the diode. [0003] Traditionally, the realization of this process is mostly realized by manual or semi-manual methods. The specific implementation method is: the first worker uses a glue dispenser to dispense glue on the lower material, and then moves the lower material that has been dispensed to the next worker. Sieve the crystal grains (that is, chips) to the dispensing position of the lower material through the shaking plate to complete the crystal bonding, and then move the semi-finished product after the crystal bonding to the next worker, who then uses the glue dispenser on the upper material. Do glue dispensing, and then attach the upper material sheet to the finish...

AI Technical Summary

Problems solved by technology

[0006] First and most importantly, in traditional manual or semi-manual operations, using a rocking plate for die bonding or artificial step-by-step manual lamination will cause potential hidden damage to the die, which exists in the die. It is also difficult to notice or detect the hidden damage in the grain during processing. After this kind of hidden damage is brought into the finished diode product, it will inevitably affect the overall quality and service life of the diode, and affect the finished product of the diode. In addition, step by step The manual operation will affect the consistency of the finished diode products, such as the uneven glue output of the dispenser, the inconsistent placement of the crystal grains, etc., will cause differences in the finished diode products of the same batch, and this difference will also cause It directly affects the downstream products. Although the appearance of the die bonder solves the consistency problem in the two steps of dispensing the lower material and bonding the die, the final step of bonding the upper material still needs to be done manually or other equipment, the problem of consistency still exists;

[0007] Secondly, the traditional manual work method requires at least 3-4 people to do the work, even if a die bonder is used to assist the work, at least 2-3 people are needed to do the work, so it consumes a lot of human resources; On the one hand, in today's increasingly bullish labor costs and labor shortages, many companies are trying their best to reduce the number of workers to control the cost of the company or ensure the normal production of the company. The above-mentioned operating methods are obviously difficult to meet the needs of the company; on the other hand On the one hand, the production efficiency of manual or semi-manual operation methods is obviously not high, and the emotional level of workers will inevitably affect their work, making the processing efficiency unstable

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