Diode packaging equipment

Abstract

The invention discloses diode packaging equipment, which comprises a machine seat, at least one conveying mechanism, a driving mechanism, a first dispensing mechanism, at least one wafer fixing mechanism, at least one wafer supply mechanism, a second dispensing mechanism and at least one manipulator mechanism, wherein the conveying mechanism is slidingly connected with the machine seat, the driving mechanism is arranged on the machine seat, the first dispensing mechanism is arranged at one end of the machine seat and is positioned above the movement direction of the conveying mechanism, the wafer fixing mechanism is arranged on the machine seat and is positioned above the movement direction of the conveying mechanism, the wafer supply mechanism is arranged on the machine seat and is positioned at one side of the wafer fixing mechanism, the wafer supply mechanism comprises an ejection mechanism and a wafer fetching movement mechanism, the second dispensing mechanism is arranged on the machine seat and is positioned above the movement direction of the conveying mechanism, the manipulator mechanism is slidingly and / or rotatably connected with the machine seat, and the first dispensing mechanism, the wafer fixing mechanism, the second dispensing mechanism and the manipulator mechanism are sequentially arranged along the movement direction of the conveying mechanism. The diode packaging equipment has the advantages that the hidden damage of a diode is reduced, the uniformity of the finished products of the diode is improved, the processing efficiency is improved, and the diode packaging equipment is more suitable for miniature diode chips.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a diode packaging device. Background technique [0002] In the packaging process of the diode, it is a very important process to attach the chip between the upper and lower material sheets of the diode. [0003] Traditionally, the realization of this process is mostly realized by manual or semi-manual methods. The specific implementation method is: the first worker uses a glue dispenser to dispense glue on the lower material, and then moves the lower material that has been dispensed to the next worker. Sieve the crystal grains (that is, chips) to the dispensing position of the lower material through the shaking plate to complete the crystal bonding, and then move the semi-finished product after the crystal bonding to the next worker, who then uses the glue dispenser on the upper material. Do glue dispensing, and then attach the upper material sheet to the finish...

AI Technical Summary

Problems solved by technology

[0006] First and most importantly, in traditional manual operations, using a rocking plate for die bonding or manual lamination will cause potential hidden damage to the die. It is also difficult to be noticed or detected. After this kind of hidden damage is brought into the finished product of the diode, it will inevitably affect the overall quality and service life of the diode, and affect the finished product of the diode. In addition, the step-by-step manual work will affect the The consistency of the finished product will affect the quality of the finished product, such as the inconsistency of the placement of the crystal grains, etc., which will cause differences in the finished diode products of the same batch. This difference will also directly affect the downstream products. The problem of consistency in the two steps of chip dispensing and crystal bonding, but in the final step of laminating the upper sheet, it still needs to be done manually or by other equipment, and the problem of consistency still exists;

[0007] Secondly, the traditional manual work method requires at least 3-4 people to do the work, even if a die bonder is used to assist the work, at least 2-3 people are needed to do the work, so it consumes a lot of human resources; On the one hand, in today's increasingly bullish labor costs and labor shortages, many companies are trying their best to reduce the number of workers to control the cost of the company or ensure the normal production of the company. The above-mentioned operation methods are obviously difficult to meet the needs of the company; on the other hand On the one hand, the production efficiency of manual or semi-manual operation is obviously not high, and the emotional level of workers will inevitably affect their work, making the processing efficiency unstable;

[0008] Finally, with the development trend of miniaturization of various types of equipment, diodes are also increasingly miniaturized, so their chips are also being processed smaller and smaller. Traditional manual or semi-manual methods are not suitable for larger chips. It can still be operated, but for small chips, the difficulty of the operation will become higher, and the quality of the finished product will also appear due to the higher difficulty of the operation.

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