Multifunctional water-based environment-friendly recyclable crystal silicon precision cutting liquid

Abstract

The invention discloses a multifunctional water-based environment-friendly recyclable crystal silicon precision cutting liquid. The multifunctional water-based environment-friendly recyclable crystal silicon precision cutting liquid contains a polyether alkanolamine pectination polymer A shown in a formula (I), ethylene epoxide and propylene epoxide reverse copolymerized polyether B shown in a formula (II) and a fatty ethylene epoxide and propylene epoxide derivative low-foaming surfactant C shown in a formula (III) as required components. Compared with the prior art, the cutting liquid disclosed by the invention has the characteristics that the application range is wide, the lubricating property is excellent, the dispersing effect is good, the ice is not generated at low temperature, the cutting liquid is recyclable, the bubble trend is low and the like, and meanwhile, the cutting liquid also has better corrosion resistance and a favorable inhibiting effect to water and silicon reaction; and the multifunctional water-based environment-friendly recyclable crystal silicon precision cutting liquid is applied in cutting and precision slice machining process of semiconductor single crystal silicon, polycrystalline silicon, sapphire, ceramic and hard brittle materials and the like.

Description

technical field [0001] The invention relates to a water-based cutting fluid, in particular to a multifunctional water-based environmental protection recyclable crystalline silicon precision cutting fluid. Background technique [0002] In the precision slicing process of semiconductor monocrystalline silicon, polycrystalline silicon, sapphire, ceramics, hard and brittle materials, etc., the existing technology adopts the method of mixing PEG and silicon carbide powder for multi-wire cutting, which has a high viscosity of the cutting fluid, and the regeneration cycle is easy to break the bond. , Insufficient cooling and lubricating effect, heavy cutting machine load, not conducive to recycling and other shortcomings. [0003] By searching existing documents, it is found that the water-based cutting fluid disclosed in Japanese Patent Application Laid-Open No. 2006-96951 is a mixture of polyalcohols such as propylene glycol, polycarboxylates, polyethylene glycol and other alkyle...

AI Technical Summary

Problems solved by technology

[0002] In the precision slicing process of semiconductor monocrystalline silicon, polycrystalline silicon, sapphire, ceramics, hard and brittle materials, etc., the existing technology adopts the method of mixing PEG and silicon carbide powder for multi-wire cutting, which has a high viscosity of the cutting fluid, and the regeneration cycle is easy to break the bond. , resulting in insufficient cooling and lubrication effects, heavy cutting machine load, not conducive to recycling and other shortcomings

[0003] By searching existing documents, it is found that the water-based cutting fluid disclosed in Japanese Patent Application Laid-Open No. 2006-96951 is a mixture of polyalcohols such as propylene glycol, polycarboxylates, polyethylene glycol and other alkylene oxide adducts and water. Due to the addition of water, this patent has the problem of corrosion of the metal of the machine and the cutting wire; Japanese Patent Laid-Open No. 2005-15617 provides a way to inhibit corrosion by using amine compounds; in addition, due to the addition of water in the water-based cutting fluid, the The reclaimed water will contact with the silicon powder in the cutting system and react to produce hydrogen gas, thereby posing safety hazards. Patent Japanese Patent Laid-Open No. 2006-88455 introduces a method of adding an oxidant that oxidizes silicon powder to inhibit the reaction between water and silicon. method, but this oxidant still has the corrosion problem to the cutting machine and metal cutting wire; the water-based cutting fluid for silicon ingot slices provided by the Chinese patent application publication number CN102482613A provides low foam, corrosion resistance and the effect of inhibiting the reaction between water and silicon Good cutting fluid, but it still has defects such as insufficient lubricating ability, insufficient wettability, insufficient dispersion of powder and freezing at low temperature

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