Novel electronic product failure rate prediction correcting method

An electronic product and failure rate technology, applied in prediction, calculation, data processing applications, etc., can solve the problems of inability to reflect the impact of product failure rate, failure to provide solder joints and printed circuit board failure rate statistics, etc., to achieve accurate and reliable. predict results, eliminate experiments, predict the effects of simple methods

Active Publication Date: 2013-08-21
BEIHANG UNIV
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Problems solved by technology

However, as long as the same component specifications and quantities are selected, even if the circuit boards are designed by different designers, components produced by different manufacturers are selected, and they are produced and assembled by different manufacturers, the average time between failures of the analyzed products is almost

Method used

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  • Novel electronic product failure rate prediction correcting method
  • Novel electronic product failure rate prediction correcting method
  • Novel electronic product failure rate prediction correcting method

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Embodiment

[0032] In the following, the present invention will be further described in detail in conjunction with the prediction process of a specific circuit module.

[0033] See figure 2 , a new method for predicting and correcting the failure rate of electronic products in the present invention, see figure 2 Shown, the specific implementation steps of its invention are as follows:

[0034] Step 1: Predicted unit composition analysis

[0035] In this embodiment, the prediction unit refers to a circuit module for prediction.

[0036] According to the physical object and schematic diagram of the circuit module, classify the components of the circuit module, obtain the components and the correlation between the components, and draw the composition structure diagram of the circuit module, among which, figure 1 It is a structural diagram of a circuit unit module of the present invention, and researches related information such as models, basic parameters and numbers of its constituent ...

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Abstract

A novel electronic product failure rate prediction correcting method includes three steps: step 1, analyzing components of a prediction unit, obtaining composition of composed components of the prediction unit, and obtaining basic information of each composed component, step 2, obtaining an electrical stress value of each composed component of the prediction unit under the normal working state through the method of electrical stress automatic emulation, substituting an electrical stress parametric model which is provided by a handbook to obtain electrical stress parameters of each component of the prediction unit, and step 3, expanding failure rate prediction. A simple method and predicted results which are accurate can be obtained through the novel electronic product failure rate prediction correcting method, and method support can be provided for accuracy of the electronic products and convenience prediction. The novel electronic product failure rate prediction correcting method has preferable practical values and wide application prospects in the technical field of electronic product reliability prediction.

Description

technical field [0001] The invention provides a new method for predicting and correcting the failure rate of electronic products. The predicting method mainly considers the correction of the encapsulation effect on the predicted result of the SN29500 manual. It relates to a reliability prediction method based on an electric stress method, and belongs to the technical field of reliability prediction of electronic products. Background technique [0002] Reliability prediction generally refers to making predictions about the reliability level of a product in a certain period of time in the future based on historical information and engineering experience. Accurate reliability prediction plays a very important role in the comparison of design schemes, feasibility analysis, life cycle cost estimation, and maintenance support plan arrangement. [0003] There are a lot of studies on the reliability prediction methods of electronic products, and many effective standards have been f...

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Application Information

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IPC IPC(8): G06Q10/04
Inventor 陈云霞井海龙康锐
Owner BEIHANG UNIV
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