Loudspeaker module

A loudspeaker module and module technology, applied in the direction of microphone, loudspeaker housing support, loudspeaker transducer fixation, etc., can solve the problem of the speaker module falling off, the combination of the speaker module and the portable electronic device is not firm, and affects the use of the portable electronic device Life and other issues, to achieve the effect of prolonging the service life, firm combination, and simple structure and operation

Active Publication Date: 2013-09-04
GOERTEK INC
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0003] Existing speaker modules include a module casing and a speaker unit housed in the module casing. The speaker module is mainly fixed inside the portable electronic device through a pasting process. This method of pasting the speaker module on the portable electronic device The fixing method has the following disadvantages: the combination of the speaker module and the portable electronic device is not firm, and when the portable electronic device is impacted by external force, the speaker module is easy to fall off from the portable electronic device, thereby seriously affecting the service life of the portable electronic device

Method used

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Embodiment Construction

[0026] The present invention will be further explained below in conjunction with the drawings and embodiments.

[0027] Such as figure 1 with figure 2 As shown together, a speaker module includes a shell, the shell is formed by combining a first cover shell 10 and a second cover shell 20, the first cover shell 10 and the second cover shell 20 enclose the module cavity, the module A speaker unit 30 is housed in the inner cavity; the module also includes a snap-fitting component that is snapped to the fixing structure on the electronic device. The snap-fitting component and the speaker unit 30 are horizontally arranged side by side inside the second cover 20. The accessory component is used to fix the speaker module on the electronic device. Without changing the original thickness and acoustic performance of the module, the card assembly increases the firmness of the combination of the module and the electronic device. This card connection method is more integrated than the pastin...

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Abstract

The invention discloses a loudspeaker module, and relates to the technical field of electroacoustic products. The loudspeaker module comprises a first cover shell and a second cover shell which are combined together. The first cover shell and the second cover shell form a module inner cavity in an enclosed mode. A loudspeaker single body is contained in the module inner cavity. The loudspeaker module further comprises a clamping assembly which is clamped with a fixing structure on electronic equipment and can fix the loudspeaker module on the electronic equipment. The loudspeaker module solves the technical problems that in the prior art, a loudspeaker module and the electronic equipment are not firmly combined and are prone to falling. The loudspeaker module can be combined with the electronic equipment firmly, is convenient to install, and effectively prolongs service life of the electronic equipment provided with the loudspeaker module.

Description

Technical field [0001] The invention relates to the technical field of electroacoustic products, in particular to a speaker module. Background technique [0002] With the rapid development of the electronics industry, portable electronic devices, such as mobile phones, ipads, etc., are popular because they are easy to carry and have comprehensive functions that can meet people's needs for Internet access, communication and entertainment. With the continuous development and popularization of portable electronic devices, speaker modules, which are important acoustic components of electronic devices, are constantly being improved. [0003] The existing speaker module includes a module housing and a speaker unit housed in the module housing. The speaker module is mainly fixed inside the portable electronic device through a pasting process. This kind of speaker module is pasted on the portable electronic device. The fixing method has the following shortcomings: that is, the speaker mod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/02
CPCH04R1/026H04R1/025H04R2201/029H04R2499/11
Inventor 万领王景伟石华
Owner GOERTEK INC
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