Diversion type auxiliary plating device and plating method aiming at plating inner surface of hollow plated part

Abstract

A diversion type auxiliary plating device and a plating method aiming at plating the inner surface of a hollow plated part are applicable to the electroplating and chemical plating fields. The diversion type auxiliary plating device is a filling part which is coincided with the shape of an inner cavity of the hollow plated part to be plated, semicircular, triangular or trapezoidal protrusions are formed on the outer surface of the diversion type auxiliary plating device to form a discontinuous runner design. The diversion type auxiliary plating device is arranged inside the hollow plated part, plating solution is filled in a clearance between the hollowed plated part and the diversion filling part, a driving device is arranged as required to stir the plating solution so as to realize uniform plating. According to the diversion type auxiliary plating device and the plating method aiming at plating the inner surface of the hollow plated part, the usage amount of the plating solution can be reduced, the plating cost can be lowered, the discontinuous runner design on the surface of the filling part is beneficial to gas emission in the plating process and the radial mass transfer of the plating solution in dynamic plating process so as to prevent the formation of layer flow on the plating surface of the plated part and facilitate the uniform plating, so that the defectiveness of the plating layer can be finally reduced, and the service life of the device in the following using process can be prolonged.

Description

technical field [0001] The invention relates to an economical diversion-type auxiliary plating device for plating the inner surface of a hollow plated part, especially for plating the inner surface of a large hollow plated part, which can effectively save the amount of plating solution and realize uniform application of the inner surface. Plating can be widely used in the fields of electroplating and chemical plating. Background technique [0002] As an effective surface treatment method, electroplating and electroless plating are widely used in the field of device protection. At present, the method of fully filling the plating solution is still used when plating the inner surface of hollow components such as pipe fittings and tanks: if the volume of the plating piece is too large, the demand for the plating solution is also large, and the excessive plating solution not only doubles the cost of the plating solution Plating cost, and a large amount of waste plating solution ...

AI Technical Summary

Problems solved by technology

At present, the method of fully filling the plating solution is still used when plating the inner surface of hollow components such as pipe fittings and tanks: if the volume of the plating piece is too large, the demand for the plating solution is also large, and the excessive plating solution not only doubles the cost of the coating solution. Plating cost, and a large amount of waste plating solution containing metal ions also increases the difficulty of subsequent treatment

In addition, whether it is electroplating or electroless plating, gas is often produced during the plating process. If it cannot be discharged in time, the bubbles dispersed in the plating solution will adhere to the plating surface of the plated piece, and finally form a plating layer with a large number of defects. In the subsequent use of the device, its service life is greatly reduced

In order to overcome the defects of the traditional plating method on the inner surface of large hollow plated parts, the present invention proposes an economical diversion type auxiliary plating device

Images