Continuous-electroplating liquid conduction apparatus and continuous liquid electroplating method

Abstract

The invention discloses a continuous-electroplating liquid conduction apparatus. The apparatus comprises a conduction tank, a water washing tank and an electroplating tank which are sequentially arranged, a member for plating sequentially traverses through the conduction tank, the water washing tank and the electroplating tank to form a continuous electroplating line, first pole plates positioned along the direction of the continuous electroplating line are arranged in the tank bodies of the conduction tank, second pole plates positioned along the direction of the continuous electroplating line are arranged in the tank bodies of the electroplating tank, a power supply is also arranged, the first pole plates are electrically connected with the negative pole of the power supply, and the second pole plates are electrically connected with the positive pole of the power supply; and an electrolyte having a depth higher than the height of the first pole plates is filled in the conduction tank, and an electroplating liquid higher than the second pole plates is filled in the electroplating tank. The apparatus and the method solve an electroplating uniformity problem, and can also solve an electroplating surface damage problem.

Description

technical field [0001] The invention relates to a continuous electroplating liquid conductive device and a continuous liquid electroplating method. Background technique [0002] The current supply method of the traditional horizontal continuous electroplating line adopts two kinds of conductive rollers and conductive clips. The conductive roller is coated with conductive metal on the surface of the roller, and the contact surface between the roller and the plated part is used to conduct electricity. Although the conductive problem is solved in this way, due to the difference in friction between the various conductive rollers, local contact is poor, the conduction is uneven, and it is easy to cause damage to the contact surface of the plated piece. The conductive clip solves the problem of conduction through the reciprocating movement of the conductive clip, but due to the intermittent reciprocating movement of the conductive clip, it leads to uneven conduction. The tension...

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Problems solved by technology

[0003] In order to overcome the above defects, the present invention provides a continuous liquid electroplating method for a continuous electroplating liquid conductive device, which not only solves the problem of electroplating uniformity, but also solves the problem of electroplating surface damage

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