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Sensor module, force detecting device, and robot

A sensor module and sensor element technology, applied in the field of sensor modules

Active Publication Date: 2013-09-18
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, in any of the above states, it is difficult to apply an equivalent boost to the sensor element 214 with the booster plate.

Method used

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  • Sensor module, force detecting device, and robot
  • Sensor module, force detecting device, and robot
  • Sensor module, force detecting device, and robot

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach ）

[0049] The sensor module of this embodiment will be described in detail with reference to the drawings.

[0050] figure 1 It is a sectional view showing the sensor module of the first embodiment. figure 2 It is a plan view showing the sensor device (the second member is omitted) of this embodiment. image 3 It is a top view showing the base member of this embodiment.

[0051]

[0052] The sensor module 10 of the first embodiment is mainly composed of the following components: a sensor device 11 in which a sensor element capable of detecting a force component is enclosed in a first member 12; The first plate 70 and the second plate 80 for supporting; and the fastening part 86 which pressurizes and fixes the sensor device 11 between the first plate 70 and the second plate 80 . The sensor device 11 of the present embodiment mainly has a first member 12 , a second member 34 , and a sensor element 42 as its basic configuration.

[0053] Such as figure 1 , figure 2 As sh...

no. 2 approach ）

[0092] Figure 7 It is a cross-sectional view of the sensor module of the second embodiment. In the sensor module 10A of the second embodiment, the second protrusion 84 is provided instead of the electronic circuit board 94 of the second board 80 of the first embodiment. The other configurations are the same as those of the sensor module 10 of the first embodiment, and are assigned the same reference numerals and detailed description thereof will be omitted.

[0093] The second plate 80A is configured such that a second protrusion 84 having substantially the same shape as the first protrusion 72 is formed on the mounting surface on which the sensor device 11 is mounted. The second convex portion 84 has a pressing surface 85 that is smaller than the bottom surface of the first member 12 and has an area equal to or larger than that of the lower surface of the sensor element 42 in plan view.

[0094] According to the sensor module 10A of the second embodiment having such a conf...

no. 3 approach ）

[0096] Figure 8 It is a cross-sectional view of the sensor module of the third embodiment. In the sensor module 10B of the third embodiment, the second concave portion 15 that fits the second convex portion 84 is formed on the lower surface of the first member 12 . The other configurations are the same as those of the sensor module 10A of the second embodiment, and are assigned the same reference numerals and detailed description thereof will be omitted.

[0097] The second concave portion 15 in the present embodiment is formed on the bottom surface of the base member 14 of the first member 12 at a position facing the lower surface of the sensor element 42 . The second concave portion 15 has a downward concave shape that fits with the second convex portion 84 , and can be formed by pressing, etching, or the like.

[0098]According to the sensor module 10B of the third embodiment having such a configuration, it is possible to easily position the center of the sensor element ...

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PUM

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Abstract

A sensor module includes a first member including a first recess in which a piezoelectric element including an electrode is arranged, a second member joined to the first member, a first plate in contact with the second member, a second plate in contact with the first member, and a fastening section configured to fasten the first plate and the second plate. A first projection projecting toward the second member is provided on the first plate. The internal height of the first recess of the first member is larger than the height of the piezoelectric element. The piezoelectric element is in contact with the second member.

Description

technical field [0001] The present invention relates to a sensor module capable of detecting force components, a force detection device and a robot using the sensor module. Background technique [0002] Conventionally, the sensor disclosed in Patent Document 1 is known as a force sensor (sensor device) using a piezoelectric material. Patent Document 1 discloses a force sensor in which a signal electrode is sandwiched by a piezoelectric material crystal disk and a measuring element sandwiched by a metal cover disk is sealed in a metal ring by welding. [0003] Patent Document 1: Japanese Patent Application Laid-Open No. 4-231827 [0004] In the force sensor of Patent Document 1, there is a fear of dimensional errors in the signal electrode, the crystal disc, and the metal cover disc. Due to these errors, gaps are formed after welding, and moisture, external air, etc. Electric charges generated on the disc may leak to the outside, and there is a possibility that accurate mea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/16B25J9/00
CPCB25J13/085G01L1/16G01L5/167G01L5/226B25J19/02G01L5/00
Inventor 河合宏纪神谷俊幸松本隆伸
Owner SEIKO EPSON CORP