Device for measuring optical performance of material under strong laser condition
A technology of optical properties and measuring devices, which is applied in measuring devices, scattering characteristics measurement, material analysis through optical means, etc., can solve the problems of high-energy laser damage mechanism materials anti-laser ability test, etc., to reduce volume and provide cooling Capable, scalable effects
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Embodiment 1
[0036] The cooling device includes a laser circulating water tank 9, a radiator circulating water tank 10, a heat exchanger 11, a semiconductor cooling chip and two water cooling heads (water cooling head A and water cooling head B respectively). The cooling end of the semiconductor refrigerating sheet is attached to the water cooling head A, and the heating end is attached to the water cooling head B. CO 2 The water inlet end of the laser tube 7 is connected to the water cooling head A, and the water outlet end is connected to the water cooling head A through the laser circulating water tank 9 . The water inlet end of the heat exchanger 11 is connected to the water cooling head B, and the water outlet end is connected to the water cooling head B through the radiator circulating water tank 10 . In this embodiment, the heat exchanger adopts an air-cooled heat exchanger to realize heat exchange between water and air. A fan is installed in the air-cooled heat exchanger, and the ...
Embodiment 2
[0039] In this embodiment, the refrigerating capacity of the cooling device is controllable through three water cooling heads, four semiconductor refrigerating plates, three temperature sensors 12, a temperature controller and two electromagnetic relays, so as to achieve the purpose of artificially controlling the refrigerating capacity. Its structural diagram is as Figure 4 As shown, the three water cooling heads are respectively water cooling head A, water cooling head B and water cooling head C; two of the four semiconductor cooling chips are connected in parallel to form two semiconductor cooling chip groups, and one semiconductor cooling chip group is installed on Between water-cooling head A and water-cooling head B, wherein water-cooling head A is attached to the heating end of the semiconductor cooling chip group, and water-cooling head B is attached to the cooling end of the semiconductor cooling chip group; another semiconductor cooling chip group is installed on the...
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