Manufacturing method of printed circuit board stepped slot and printed circuit board comprising stepped slot

A technology for printed circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of high price of fillers, high production costs, and high requirements for the dimensional accuracy of fillers, so as to avoid costs, The effect of convenient production process

Active Publication Date: 2013-09-18
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method requires high dimensional accuracy of the filler, and the price of the filler is high, resulting in high overall production costs.
At the same time, when the size of the stepped

Method used

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  • Manufacturing method of printed circuit board stepped slot and printed circuit board comprising stepped slot
  • Manufacturing method of printed circuit board stepped slot and printed circuit board comprising stepped slot
  • Manufacturing method of printed circuit board stepped slot and printed circuit board comprising stepped slot

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Embodiment Construction

[0022] The main realization principles, specific implementation modes and corresponding beneficial effects of the technical solutions of the embodiments of the present invention will be described in detail below in conjunction with each accompanying drawing.

[0023] In order to solve the problems existing in the prior art, an embodiment of the present invention provides a method for manufacturing a stepped groove of a printed circuit board, such as figure 1 As shown, the method includes:

[0024] Step 101, according to the predetermined circuit pattern, open a window on the position corresponding to the stepped groove on the low-flow glue prepreg;

[0025] Step 102, placing the window-opened, low-flow glue prepreg between the upper core board and the lower core board;

[0026] Step 103, laying cushions on the outer sides of the upper core board and the lower core board respectively, and then pressing them together to form a printed circuit board;

[0027] Step 104, accordin...

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PUM

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Abstract

The invention relates to the technical field of a printed circuit board, in particular to a manufacturing method of a printed circuit board stepped slot and a printed circuit board comprising the stepped slot. The method comprises the steps of: windowing on a low flow glue prepreg at a position corresponding to a stepped slot according to a predetermined circuit diagram; placing the windowed low flow glue prepreg between an upper core plate and a lower core plate; paving a buffer on the outer sides of the upper core plate and the lower core plate respectively and then laminating to form the printed circuit board; performing controlled deep milling from the up direction of the upper core plate according to the predetermined circuit diagram to form the stepped slot. By using the manufacturing method of the printed circuit board stepped slot and the printed circuit board comprising the stepped slot provided by the embodiment of the invention, the manufacturing flow of the printed circuit board stepped slot can be simplified, the manufacturing efficiency can be improved and the cost can be saved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing stepped grooves of a printed circuit board and a printed circuit board including the stepped grooves. Background technique [0002] At present, the stepped groove of PCB (PCB Printed Circuit Board, printed circuit board) has a wide range of applications, and is generally used in devices such as power amplifiers. In the prior art, when making printed circuit boards with stepped grooves, the process is relatively complicated. Generally, it includes the following steps: press together a plurality of core boards that need to be made with stepped grooves, and then perform Open the window; open the window at the position of the prepreg corresponding to the stepped groove; place the windowed prepreg on the bottom core board that does not need to be slotted, and then place the windowed core board on the prepreg; at the position of the stepped gro...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K1/02
Inventor 黄翔
Owner NEW FOUNDER HLDG DEV LLC
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