Manufacturing method of printed circuit board stepped slot and printed circuit board comprising stepped slot

Abstract

The invention relates to the technical field of a printed circuit board, in particular to a manufacturing method of a printed circuit board stepped slot and a printed circuit board comprising the stepped slot. The method comprises the steps of: windowing on a low flow glue prepreg at a position corresponding to a stepped slot according to a predetermined circuit diagram; placing the windowed low flow glue prepreg between an upper core plate and a lower core plate; paving a buffer on the outer sides of the upper core plate and the lower core plate respectively and then laminating to form the printed circuit board; performing controlled deep milling from the up direction of the upper core plate according to the predetermined circuit diagram to form the stepped slot. By using the manufacturing method of the printed circuit board stepped slot and the printed circuit board comprising the stepped slot provided by the embodiment of the invention, the manufacturing flow of the printed circuit board stepped slot can be simplified, the manufacturing efficiency can be improved and the cost can be saved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing stepped grooves of a printed circuit board and a printed circuit board including the stepped grooves. Background technique [0002] At present, the stepped groove of PCB (PCB Printed Circuit Board, printed circuit board) has a wide range of applications, and is generally used in devices such as power amplifiers. In the prior art, when making printed circuit boards with stepped grooves, the process is relatively complicated. Generally, it includes the following steps: press together a plurality of core boards that need to be made with stepped grooves, and then perform Open the window; open the window at the position of the prepreg corresponding to the stepped groove; place the windowed prepreg on the bottom core board that does not need to be slotted, and then place the windowed core board on the prepreg; at the position of the stepped gro...

AI Technical Summary

Problems solved by technology

However, this method requires high dimensional accuracy of the filler, and the price of the filler is high, resulting in high overall production costs.

At the same time, when the size of the stepped grooves is relatively small and the number is relatively large, the placement of fillers will reduce the efficiency or make it impossible to realize the production of printed circuit boards at all.

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