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Rigid-flex circuit board manufacturing method

A soft-rigid combination and manufacturing method technology, applied in the direction of assembling printed circuits with electrical components, can solve problems such as multi-space, space limitation of flexible-rigid circuit boards, and inability to meet the requirements of miniaturization of flexible-combined circuit boards, etc. Save the occupied volume and meet the effect of miniaturization

Active Publication Date: 2016-03-30
QING DING PRECISION ELECTRONICS HUAIAN CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the requirement of miniaturization and high circuit density of flexible combined circuit boards, the space occupied by flexible and rigid combined circuit boards after packaging is also limited
When the electronic components are packaged on the surface of the rigid-flex circuit board, it takes up more space
And it is necessary to set more lines in the flexible and rigid circuit board, so that it cannot meet the miniaturization requirements of the flexible and rigid circuit board

Method used

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  • Rigid-flex circuit board manufacturing method
  • Rigid-flex circuit board manufacturing method
  • Rigid-flex circuit board manufacturing method

Examples

Experimental program
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Effect test

Embodiment Construction

[0072] The manufacturing method of the soft-rigid circuit board provided by the technical solution includes the following steps:

[0073] For a first step, see figure 1 , providing a flexible circuit board 110 .

[0074] The flexible circuit board 110 is a circuit board fabricated with conductive circuits. The flexible circuit board 110 can be a single-sided circuit board or a double-sided circuit board. In this embodiment, the flexible printed circuit board 110 is taken as an example for illustration. The flexible circuit board 110 includes a first insulating layer 111 , a first conductive circuit 112 , a second conductive circuit 113 , a cover film 116 , a first electronic component 41 and a second electronic component 42 . The first insulating layer 111 includes an opposite first surface 1111 and a second surface 1112, the first conductive circuit 112 is formed on the first surface 1111 of the first insulating layer 111, and the second conductive circuit 113 is formed on...

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Abstract

Provided is a manufacturing method of a rigid-flex circuit board. The manufacturing method comprises the following steps: a flexible circuit board is provided and the flexible circuit board comprises a bending region and a fixing region, and the fixing region of the flexible circuit board is stuck with a first electronic element; a rigid circuit board is provided and the internal part of the rigid circuit board is provided with a first opening corresponding to the bending region and a first accommodating groove corresponding to the first electronic element; a first film, a third film and a first copper foil are provided, wherein the first film is provided with a third opening and a first through hole; the first copper foil, the third film, a first rigid circuit board, the first film and the soft circuit board are successively stacked and stitched together, and the accommodating groove is communicated with the through hole and the first electronic element is accommodated inside the first through hole and the first accommodating groove; an outer layer circuit is made and formed by the first copper foil corresponding to the fixing region; and the first copper foil and a second film corresponding to the bending region are removed and thus the rigid-flex circuit board is obtained.

Description

technical field [0001] The invention relates to the field of circuit board manufacture, in particular to a method for manufacturing a circuit board with embedded electronic components. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, HighdensitymultilayerprintedcircuitboardforHITACM-880, IEEETrans.onComponents, Packaging, and ManufacturingTechnology, 1992, 15(4):1418-1425. [0003] Rigid-flex circuit board is a circuit board structure including interconnected flexible boards and rigid boards, which can not only have the flexibility of flexible circuit boards, but also include the hardness of rigid circuit boards. With the requirement for miniaturization of flexible combined circuit boards and higher circuit density, the space occupied by the packaged fl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/36
Inventor 邝浩文豪顿哈普
Owner QING DING PRECISION ELECTRONICS HUAIAN CO LTD
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