Technological method for plating and etching multilayer circuit substrate of metal frame

Abstract

The invention relates to a technological method for plating and etching a multilayer circuit substrate of a metal frame. The technological method for plating and etching the multilayer circuit substrate of the metal frame comprises the following technological steps of (1) taking the metal substrate, (2) carrying out copper foil electroplating on the surface of the metal substrate, (3) carrying out operation of pasting a photoresistance membrane, (4) removing part of the photoresistance membrane on the reverse side of the metal substrate, (5) carrying out electroplating of a first metal circuit layer, (6) carrying out operation of pasting a photoresistance membrane, (7) removing part of the photoresistance membrane on the reverse side of the metal substrate, (8) carrying out electroplating of a second metal circuit layer, (9) removing the photoresistance membranes, (10) pasting and pressing a non-conducting adhesive membrane, (11) carrying out grinding on the surface of the non-conducting adhesive membrane, (12) carrying out metalizing preprocessing on the surface of the non-conducting adhesive membrane, (13) carrying out operation of pasting a photoresistance membrane, (14) removing part of the photoresistance membrane on the reverse side of the metal substrate, (15) carrying out electroplating of a third metal circuit layer, (16) carrying out operation of pasting a photoresistance membrane, (17) removing part of the photoresistance membrane on the reverse side of the metal substrate, (18) carrying out electroplating of a fourth metal circuit layer, (19) removing the photoresistance membranes, (20) carrying out epoxy resin transfer injection moulding, (21) carrying out grinding on the surface of epoxy resin, (22) carrying out operation of pasting a photoresistance membrane, (23) removing part of the photoresistance membrane on the obverse side of the metal substrate, (24) carrying out etching, (25) removing the photoresistance membranes, and (26) carrying out electroplating of a metal layer.

Description

technical field [0001] The invention relates to a metal frame multilayer circuit substrate first plating and then etching method, which belongs to the technical field of semiconductor packaging. Background technique [0002] Traditional multilayer circuit substrates use expensive organic sheets as the main structural substrate material. The specific process and methods are as follows: Copper foil pressure bonding on one or both sides of the organic substrate→coating photoresist→ Exposure, development, window opening→etching (retaining the circuit)→copper foil etching→stripping off the photoresist→copper foil bonding of the second layer of circuit→coating photoresist→exposure, development, window opening→etching (Reserve the circuit) → Strip photoresist → Drill the second layer of copper foil and the first layer of copper foil → Electroplating and filling the metal material → Grinding → Coating insulating green paint → Exposure, development, window opening → Nickel plating G...

AI Technical Summary

Problems solved by technology

[0014] C), the depth of mechanical drilling is easy to have different depth accuracy in the processing of high-density and ultra-thin substrates, so when the depth is insufficient, the copper foil will not be fully exposed or not exposed, making subsequent deep filling of metal materials When the hole is filled, the metal material for filling the hole cannot be tightly bonded to the copper foil, which virtually increases the contact resistance or even opens the circuit (see Figure 29 );

[0015] D), the laser drilling processing method (commonly known as laser engraving) is more precise in the depth of drilling than the mechanical drilling processing method, especially as long as the carbon dioxide laser touches the copper material, the laser performance will be broken down , while the stop point of the laser

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