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Pins with different heights for semiconductor coating device and use method thereof

A coating equipment, semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem of different pin heights, meet the requirements of low precision parts, good performance requirements, and achieve the effect of horizontal support

Active Publication Date: 2013-10-02
PIOTECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem of unequal pin heights at different support points in the prior art, and to provide a pin that can be used at each support point with the same structure but different heights. To achieve a highly consistent technical problem at each support point

Method used

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  • Pins with different heights for semiconductor coating device and use method thereof

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Embodiment

[0010] refer to figure 1 , Semiconductor coating equipment uses pins of different heights and usage methods, and the pins have multiple different heights. According to its reference value, the height of the pin is divided into 5 height values ​​according to the upper and lower heights, and the height difference is set as 0.1mm, 0.2mm, 0.3mm range. The top surface 1 of the pin adopts a spherical structure, and this part is a part in direct contact with the wafer. Ensure that the pin and the wafer are always in a tangential state, and there will be no adhesion due to external factors such as high temperature and process testing. What the upper end part 2 of pin adopts is conical structure, and this structure can be more conducive to the smooth running of pin when contacting with heating plate during lifting process. The main part 3 of the pin is a cylindrical structure, which has a certain degree of straightness, so as to ensure that when the pin is in a high temperature stat...

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Abstract

The invention discloses pins with different heights for a semiconductor coating device and a use method thereof, and mainly aims to solve the problem in the prior art that heights of pins at different supporting points are inconsistent. The plurality of pins with same structures but different heights are arranged at the supporting points to achieve the same height of the pins at the supporting points. In the invention, through switching among the pins with the different heights, the pins are enabled to be consistent in the height at the supporting points to ensure normal transmission of a wafer. An upper end portion of a pin main body is a cone structure, an upper end surface of the pin main body is a spherical structure; a transition zone is arranged between the upper end surface of the pin main body and the upper end portion of the pin main body; the transition zone and a joint section between an upper end of the transition zone and the pin main body are rounded structures; and a lower end surface of the pin main body is a hemispherical structure. In the method, in accordance with a pin height reference value, two height differences are respectively arranged over the pin height reference value and under the pin height reference value, i.e., the pins with five different heights can meet use requirements of devices. Compared with the prior art, the pins with the different heights of the invention is more reasonable, simple in structure and requires relatively low-precision parts.

Description

technical field [0001] The invention relates to pins of different heights used in semiconductor coating equipment and a method for using them. To be precise, the new pins with the same structure but different heights are used to achieve the same purpose and thus simplify operation, and belong to the field of semiconductor film deposition application and manufacturing technology. Background technique [0002] Existing semiconductor coating equipment, especially 12-inch semiconductor coating equipment, uses various forms of pins (Pins) to support and lift wafers, but the requirements for pins are consistent, that is, during the transfer of wafers, During the lifting process of the pin lifting system, it is necessary to ensure that the pins at each support point are lifted and lowered smoothly, without any abnormal phenomena such as tilting and stagnation. At the same time, it is also necessary to ensure that the height of the highest point of the pin at each support point is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687
Inventor 吴凤丽聂文远国建花
Owner PIOTECH CO LTD
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