A Triangular Envelope Based Method for Predicting the Strength of Composite π-Shaped Non-planar Bonded Joints
A composite material and connection strength technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of long development cycle and high cost, and achieve the effect of reducing test cost, simplifying calculation process, and shortening development cycle.
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[0041] Example 1: Prediction of π-shaped non-planar adhesive connection strength of composite materials
[0042] 1. Geometric description:
[0043] The composite material π-shaped non-planar adhesive connection structure is 200mm long, 160mm high, and 50mm wide. It is divided into three parts: skin, web and π reinforcement. π reinforcement includes L layup, U layup, and one-shape layup. And the packing area, each part is ideally bonded with adhesive, and the material is T700 / QY8911.
[0044] (1) Left and right layer of web: [0° / 0° / 45° / -45°] s , each with a thickness of 1mm;
[0045] (2) Upper and lower layers of skin: [45° / 90° / -45° / 0°] s , each with a thickness of 1mm;
[0046] (3) π-reinforced layup: L layer and U layer are [45° / 90° / -45°], one-shape layer is [-45° / 90° / 45°], each thickness is 0.36mm, filler It is a 0° unidirectional belt, and the 0° direction is along the width direction of the π joint.
[0047] 2. Finite element model establishment and strength predict...
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