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Oxide semiconductor thin film transistor and manufacturing method thereof

A technology of oxide semiconductors and thin film transistors, which is applied in semiconductor/solid-state device manufacturing, transistors, semiconductor devices, etc., can solve problems such as damage and damage to the reliability of oxide semiconductor thin film transistor components, and achieve high reliability.

Active Publication Date: 2015-08-26
吴江汾湖科技创业服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the conductive layer is patterned by an etching process to form the source and the drain, the channel layer located between the source and the drain may be damaged due to the influence of the etchant, thus destroying the reliability of the components of the oxide semiconductor thin film transistor. Spend

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  • Oxide semiconductor thin film transistor and manufacturing method thereof
  • Oxide semiconductor thin film transistor and manufacturing method thereof
  • Oxide semiconductor thin film transistor and manufacturing method thereof

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Embodiment Construction

[0033] Figure 1A to Figure 1E It is a schematic top view of the manufacturing process of an oxide semiconductor thin film transistor according to an embodiment of the present invention. Figure 2A to Figure 2E respectively along Figure 1A to Figure 1E The cross-sectional schematic diagram of the section line A-A'. It should be noted that, Figure 1A to Figure 1E The schematic diagram of the top view omits part of the film layer to clearly show the position of each component. Please refer to Figure 1A as well as Figure 2A , forming a scan line SL, a gate G and a gate insulating layer 110 on a substrate 102 . Specifically, a gate material layer may be formed by a sputtering process first, and then the scan lines SL and the gate G are defined by a patterning process. The patterning process is, for example, a photomask process, which includes steps such as photoresist coat, exposure, develop, etch, and strip. The material of the gate material layer includes chromium (Cr), ...

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Abstract

The invention provides an oxide semiconductor film transistor including a source electrode, a drain electrode, a channel layer, an insulting layer, a first conductor and a second conductor. The channel layer is arranged between the source electrode and the drain electrode and is isolated from the source electrode and the drain electrode. An insulating layer covers the source electrode, the drain electrode and the channel layer. The first layer is at least disposed in a first opening of the insulating layer, so as to contact with the source electrode and the channel layer. The second conductor is at least disposed in a second opening of the insulating layer, so as to contact with the drain electrode and the channel layer.

Description

technical field [0001] The present invention relates to a thin film transistor and its manufacturing method, and in particular to an oxide semiconductor thin film transistor and its manufacturing method. Background technique [0002] Generally speaking, multiple components (such as gate, source, drain, channel layer, and pixel electrode) constituting the oxide semiconductor thin film transistor are fabricated in multiple processes. Wherein, the source and the drain are usually produced by the same process, while the channel layer is produced by another process, and the order of the two processes is not limited. For example, the source electrode and the drain electrode can be formed first, and then the channel layer can be formed, wherein, when the material layer of the channel layer is formed by a coating process, the ambient gas (such as oxygen plasma, oxygen plasma) in the process may An oxide layer is formed on the surface of the source electrode and the drain electrode....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/786H01L29/06H01L21/34
Inventor 张锡明
Owner 吴江汾湖科技创业服务有限公司