Device and method for press-fitting flat plate type semiconductor element on press-fitting equipment

Abstract

The invention provides a device for press-fitting a flat plate type semiconductor element on press-fitting equipment. The device comprises a pressing plate, a pressing mechanism which is arranged on the pressing plate and comprises a central column body provided with an end flange, and an elastic element which is arranged between the end flange and the pressing plate, wherein the central column body can move along the direction vertical to the pressing plate by means of an adjusting element so that the elastic element remains under a preset pretightening force; the device is connected with the press-fitting equipment through the pressing plate so that the surface of the pressing mechanism is contacted with the surface of the flat plate type semiconductor element to be press-fitted; and the pretightening force of the elastic element is transferred onto the flat plate type semiconductor element through the pressing mechanism by releasing the adjusting element. The invention also provides a corresponding method. According to the method and the device disclosed by the invention, the accuracy of press-fitting force is ensured; and when the semiconductor element works normally, the influence on the press-fitting force caused by strong external vibration is prevented.

Description

technical field [0001] The invention relates to a pressing device, in particular to a device for pressing flat semiconductor elements on pressing equipment. [0002] The invention also relates to a method for press-fitting flat semiconductor components. [0003] The invention also relates to a method for exchanging flat semiconductor components during press-fitting operations. Background technique [0004] When the flat semiconductor component works normally, a certain pressing force must be applied at both ends, and the value of the pressing force must be kept within a certain range continuously to ensure that the heat generated by the component due to power consumption is transferred away. [0005] When the press-fit force is lower than the minimum specified value of the flat semiconductor component, it will cause an increase in the contact thermal resistance and contact resistance between the component and the heat sink, and may cause the on-state voltage drop of the com...

AI Technical Summary

Problems solved by technology

[0008] Especially when there are components such as radiators and water pipes, they will form a power device string with semiconductor components. If components need to be replaced, the entire power device string must be removed, and semiconductor components, radiators and other components must be re-stacked. Recheck the pressing force, which brings great inconvenience to the engineering application of flat semiconductor components

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