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Low space color cast LED packaging structure

A LED packaging, low-space technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problem of uneven light mixing, achieve the effect of uniform light mixing and reduce spatial color shift

Active Publication Date: 2013-10-23
NAT CENT UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The hemispherical LED package structure 101 can reduce the ACCTD to about 500-750K, slightly improve the problem of too large ACCTD, and further improve the degree of uneven light mixing. However, it is still expected that there will be an LED package structure with very uniform light mixing from all angles.

Method used

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Embodiment Construction

[0035] In order to further explain the technical means adopted by the present invention to achieve the intended purpose of the invention and its efficacy, the following will be combined with the accompanying drawings and preferred embodiments to describe the specific implementation, structure, Features and their functions are described in detail below.

[0036] Figure 4 It is a perspective view of an LED packaging structure according to an embodiment of the present invention. Figure 5 It is a cross-sectional view of an LED package structure according to an embodiment of the present invention. Figure 6 It is a relationship diagram of the angular relative color temperature deviation and the vertical distance from the bottom surface to the substrate according to an embodiment of the present invention. Figure 7 It is a relationship diagram between relative color temperature and viewing angle according to an embodiment of the present invention.

[0037] Such as Figure 4 an...

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Abstract

The invention discloses a low space color cast LED packaging structure comprising a substrate, an LED chip, a phosphor body and a lens, wherein the LED chip is arranged on the substrate, the phosphor body comprises a positive hemisphere body and an extending part which is formed by extending the lower part of the positive hemisphere body, the phosphor body is arranged on the substrate and covers the LED chip, and the lens is arranged at the outer side of the phosphor body in a covering manner and therefore light extraction efficiency can be improved. Through an embodiment of the low space color cast LED packaging structure, long perpendicular distance is enabled between the LED chip and the top part of the phosphor body the arrangement of the extending part, long optical length of forward direction light of the LED chip is realized, and therefore space color cast can be lowered.

Description

technical field [0001] The invention relates to an LED packaging structure with low spatial color shift, in particular to an LED packaging structure with low spatial color shift that can make light mixing more uniform. Background technique [0002] With the development of science and technology, there are many ways to make white LEDs. For example, red, green and blue LED chips can be used to mix light into white light, and ultraviolet LED chips can be used to excite red, green and blue phosphors to produce white light. white light. At present, the most common white LED packaging method is to cover the outside of the blue LED chip with a phosphor containing yellow phosphor, so as to use the blue light to excite the yellow phosphor to generate white light; although the optical efficiency of white light produced by this method is relatively low. Low, but it has the advantage of reducing the production cost of white LEDs. [0003] Such as figure 1 As shown, it is a cross-sect...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/58
Inventor 孙庆成陈静仪邱志煜
Owner NAT CENT UNIV
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