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Substrate cutting device and method thereof

A technology of cutting device and cutting method, which is applied in the direction of glass cutting device, glass manufacturing equipment, laser welding equipment, etc., can solve problems such as excessive process time and cost, affect cutting quality, and cannot be used, so as to save process time and cost , Improve the effect of cutting quality

Active Publication Date: 2016-01-20
CHARM ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For large-area substrates, since micro-cracks will also affect the cutting quality, the method cannot be used for substrate cutting
In addition, excessive process time and cost are consumed when cutting large area substrates with laser

Method used

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  • Substrate cutting device and method thereof
  • Substrate cutting device and method thereof
  • Substrate cutting device and method thereof

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Embodiment Construction

[0048] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments capable of implementing the present invention. These embodiments are described in detail so that those skilled in the art can fully practice. It should be understood that the various embodiments of the invention differ from each other, but are not mutually exclusive. For example, the specific shape, structure and characteristics of an embodiment described herein can also be implemented by other embodiments without departing from the spirit and scope of the present invention. In addition, it should be understood that the positions and arrangements of individual constituent elements in each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Therefore, the following detailed description is not intended to be limiting, and it is accurately stated that the scope of protection of the present...

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Abstract

The invention relates to a substrate cutting device and a substrate cutting method. The substrate cutting device is characterized by comprising a working table (100) for placing a substrate (10), a laser part (200) for generating laser beams (L1, L2), beam splitters (BS) for splitting the laser beams (L1, L2) into first laser beams (L1) and a second laser beam (L2), a first processing part (300) for subjecting the internal of the substrate (10) to scribing treatment with the first laser beams (L1) to form a first etching part (P1, P2), and a second processing part (400) for subjecting the internal of the substrate (10) to beam swing scribing treatment with the second laser beam (L2) to form a second etching part (P3).

Description

technical field [0001] The invention relates to a substrate cutting device and a method thereof. More specifically, it relates to a method of using a first laser beam to perform scribe processing on the inside of a substrate to form a first etched portion, and using a second laser beam to perform beam swing scribing processing on the inside of a substrate to form a second etched portion. , thereby cutting a substrate substrate cutting device and method thereof. Background technique [0002] The use of lasers in material processing is rapidly expanding throughout industry. Laser processing has excellent characteristics in terms of accuracy, process flexibility, non-contact processability, and thermal influence on materials. There is craftsmanship. [0003] figure 1 It is a schematic diagram of the structure of the substrate cutting device involved in the prior art. [0004] refer to figure 1 , in order to cut the substrate 10 placed on the table 1, using a cutter wheel ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/08
CPCB23K26/0622B23K26/0626B23K26/0648B23K26/067B23K26/16B23K26/38
Inventor 郑薰尹星进辛圭晟
Owner CHARM ENG CO LTD