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Method and apparatus for inspecting vias

A technology of vias and reference values, applied in the direction of using optical devices, material analysis by optical means, image data processing, etc., can solve problems such as abnormal vias, printed circuit board failures, etc.

Inactive Publication Date: 2018-05-04
HANWHA AEROSPACE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when vias are formed, abnormal vias may be formed, which may cause failure of the printed circuit board

Method used

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  • Method and apparatus for inspecting vias
  • Method and apparatus for inspecting vias
  • Method and apparatus for inspecting vias

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Embodiment Construction

[0023] The present invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. In the drawings, the same reference numerals denote the same elements. Expressions such as "at least one of," when preceding a list of elements, modify the entire list of elements and do not modify the individual lists of elements.

[0024] figure 1 is a schematic diagram of a via inspection device 101 according to an embodiment of the present invention. refer to figure 1 , the via inspection device 101 includes a support 111 , a camera 121 , a memory 131 , a controller 141 , a display 151 and a main body 105 .

[0025] A circuit board on which, for example, a semiconductor chip or a circuit is formed is mounted on the support 111 . at least one via 165 (see image 3 ) is formed in the material 161 , and the at least one via hole 165 is formed vertically through the material 161 .

[0026] image 3 is a cro...

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Abstract

An apparatus and method for determining vias using a camera. The method includes: (a) capturing an image of an area of ​​a via; (b) extracting an edge from the image; (c) detecting a maximum value by performing a Hough transform on the edge; (d) calculating the location of the maximum value The surface area of ​​the circle as the center; (e) The state of the via is checked by comparing the maximum value, the position and the surface area of ​​the circle with the reference value.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2012-0050462 filed with the Korean Intellectual Property Office on May 11, 2012, the disclosure of which is hereby incorporated by reference. technical field [0002] The present invention relates to a printed circuit, and more particularly, to a method and apparatus for inspecting via holes formed in a device on which the circuit is printed for defects. Background technique [0003] A plurality of active devices are mounted on a printed circuit board on which predetermined circuit patterns for electrically connecting the plurality of active devices are formed. The circuit pattern is formed on only one surface of the printed circuit board, but currently, as the functions of the printed circuit board become complicated, the circuit pattern is formed on both surfaces of the printed circuit board. In order to electrically connect circuit patterns formed on both surfaces of the printed circuit board, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/88
CPCG01B11/12G01N2021/8893G06T7/168H01L22/12H05K13/081
Inventor 李活石
Owner HANWHA AEROSPACE CO LTD