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Polishing composition, polishing method using same, and substrate production method

A technology for grinding substrates and grinding methods, applied in polishing compositions containing abrasives, manufacturing tools, grinding devices, etc., can solve the problem that the surface of the substrate is not hydrophilic enough to inhibit the adhesion of the surface of the substrate, etc., and achieves reduction of nano-scale LPD. Effect

Active Publication Date: 2013-11-20
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the hydrophilicity of the substrate surface imparted by the polishing composition disclosed in Patent Document 1 is insufficient to suppress the adhesion of foreign matter to the substrate surface.

Method used

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  • Polishing composition, polishing method using same, and substrate production method
  • Polishing composition, polishing method using same, and substrate production method
  • Polishing composition, polishing method using same, and substrate production method

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Embodiment Construction

[0019] Embodiments of the present invention are now described as follows.

[0020] [1] The polishing composition of the present invention

[0021] The grinding composition of the present invention is characterized in that it contains a composition (A) containing hydroxyethyl cellulose, abrasive grains, ammonia and water, and at least one selected from organic acids and organic acid salts, wherein the grinding The electrical conductivity of the composition is 1.2 to 8 times that of the composition (A).

[0022] A polishing composition comprising hydroxyethyl cellulose and an organic acid or salt of an organic acid imparts improved hydrophilicity to the surface of the polished substrate. The present inventors empirically found that improved hydrophilicity varies depending on the increase rate of conductivity of the polishing composition caused by organic acids and organic acid salts.

[0023] Conductivity is a value representing the ability of a substance to allow an electric ...

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Abstract

Provided is a polishing composition characterized by: including at least one of either organic acid or organic salt and including a composition (A) including hydroxyethyl cellulose, ammonia, abrasive grains, and water. The electrical conductivity of the polishing composition is 1.2 to 8 times the electrical conductivity of the composition (A). The polishing composition is mainly used in substrate surface polishing applications.

Description

technical field [0001] The present invention relates to a polishing composition for polishing a substrate, a substrate polishing method using the polishing composition, and a substrate manufacturing method. Background technique [0002] In semiconductor devices used in computers such as ULSI (Ultra Large Scale Integration), miniaturization of design specifications has been accelerated year by year in order to achieve high integration and high speed. In this trend, the number of cases where small defects on the surface of a substrate for a semiconductor device adversely affect the performance of the semiconductor device is increasing. Therefore, overcoming nanoscale surface defects that have never been considered a problem has become important. [0003] The surface defect of the substrate is detected as a light point defect (LPD). LPDs are classified into those caused by crystal-oriented particles (COPs) and those caused by foreign substances adhering to the substrate surfa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14B24B37/00H01L21/304
CPCC09G1/04C09G1/02B24B37/044H01L21/02024C09K3/1409H01L21/30625H01L21/304C09K3/14
Inventor 土屋公亮久保惠高桥修平
Owner FUJIMI INCORPORATED