Epoxy resin composition for electronic packaging and preparation method thereof

An epoxy resin, electronic packaging technology, used in circuits, electrical components, electrical solid devices, etc.

Inactive Publication Date: 2013-12-18
HENKEL HUAWEI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in epoxy molding compounds, even if the mass percentage of the inorganic filler silica used is as high as 80% or more, due to the inherent characteristics of the resin and additives, the production The epoxy molding compound produced has a relatively high water absorption, molding shrinkage rate or thermal expansion coefficient, which seriously affects the insulation and high-voltage resistance of the packaging material.
In addition, the leakage current phenomenon of many epoxy molding compound packaged devices is also very serious under high temperature and high pressure, which will cause the failure of the entire device

Method used

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  • Epoxy resin composition for electronic packaging and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] 3 parts of epoxy resin with naphthalene skeleton, 5 parts of dicyclopentadiene type epoxy resin, 2.5 parts of phenol novolac resin, 2.5 parts of phenol aralkyl novolac resin, 0.1 part of N, N'-dimethylaniline , 0.1 part of triphenylphosphine, 40 parts of spherical silica, 43 parts of fused silica, 0.8 part of coupling agent, 0.9 part of release agent, 1.3 part of stress modifier, 0.55 part of ion trapping agent, 0.25 After stirring evenly with a high-speed mixer, put it into a twin-screw extruder to heat, knead and extrude. The extruded product is calendered, cooled and crushed to obtain molding compound powder and test its performance. Product performance Listed in Table 1.

Embodiment 2

[0024] 8.4 parts of dicyclopentadiene type epoxy resin, 2.5 parts of phenol novolac resin, 2.1 parts of phenol aralkyl novolac resin, 0.1 part of N, N'-dimethylaniline, 0.1 part of triphenylphosphine, 40 parts of spherical Type silica, 43 parts of fused silica, 0.8 part of coupling agent, 0.9 part of mold release agent, 1.3 part of stress modifier, 0.55 part of ion trapping agent, 0.25 part of carbon black, after stirring evenly with a high-speed mixer, Put it into a twin-screw extruder for heating, kneading and extruding. The extruded product was calendered, cooled and pulverized to obtain molding compound powder and its properties were tested. The product properties are listed in Table 1.

Embodiment 3

[0026] 7.8 parts of epoxy resin with naphthalene skeleton, 2.5 parts of phenol novolac resin, 2.7 parts of phenol aralkyl phenolic resin, 0.1 part of N, N'-dimethylaniline, 0.1 part of triphenylphosphine, 40 parts of spherical Silicon dioxide, 43 parts of fused silica, 0.8 part of coupling agent, 0.9 part of mold release agent, 1.3 part of stress modifier, 0.55 part of ion trapping agent, 0.25 part of carbon black, after stirring evenly with a high-speed mixer, put into a twin-screw extruder for heating, mixing and extrusion, and the extruded product was calendered, cooled and pulverized to obtain molding compound powder and its properties were tested. The product properties are listed in Table 1.

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PUM

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Abstract

The invention relates to an epoxy resin composition enabling a packaged device to withstand high voltage below 2000 volts and a preparation method thereof. The epoxy resin composition mainly comprises epoxy resin, phenolic resin and filler, and may also comprise a curing accelerator and other additive. The epoxy resin has a backbone structure containing naphthyl, and / or is dicyclopentadiene-type epoxy resin, and / or is multi-aromatic-ring type epoxy resin, and / or is trisphenol methane type epoxy resin. After the epoxy resin composition is used for chip packaging, the packaged device can withstand the high voltage below 2000 volts.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging materials, and in particular relates to an epoxy resin composition capable of making packaging devices withstand high voltages below 2000 V and a preparation method thereof. Background technique [0002] Today's electronic products are developing in the direction of miniaturization, portability, low cost, low power consumption, environmental protection and high reliability, which puts forward higher requirements for packaging materials. At present, the most suitable material for plastic packaging of integrated circuits in the world is epoxy molding compound, which accounts for more than 95% of plastic packaging materials. This is because the plastic package is a non-hermetic package, the material cost is low, and the molding process is relatively simple, and with the research, development and utilization of new epoxy resin and phenolic resin, the reliability of plastic package devices...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/62C08K13/02H01L23/29
Inventor 刘成杰金松谢广超
Owner HENKEL HUAWEI ELECTRONICS
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