Axial macro-micro adjusting device for optical element in photoetching projection objective lens system

A technology for lithography projection and optical components, which is applied in the direction of optical components, microlithography exposure equipment, photo-plate making process exposure devices, etc., can solve the problems of small adjustment stroke and tilt error, so as to avoid damage, eliminate tilt error, and quickly The effect of large stroke adjustment

Inactive Publication Date: 2015-06-10
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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Problems solved by technology

[0005] In order to solve the problem of small adjustment stroke and tilt error existing in the existing optical element axial adjustment device, the present invention provides an axial macro-micro adjustment device for optical elements in a lithography projection objective lens system

Method used

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  • Axial macro-micro adjusting device for optical element in photoetching projection objective lens system
  • Axial macro-micro adjusting device for optical element in photoetching projection objective lens system
  • Axial macro-micro adjusting device for optical element in photoetching projection objective lens system

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with the accompanying drawings.

[0017] like figure 1 As shown, the axial macro-fine adjustment device of optical elements in the lithography projection objective lens system includes a capacitive sensor 1, a frame 3, a macro-fine adjustment mechanism 4 and a guide rail 5, and the capacitive sensor 1 is arranged above the frame 3 for detecting The moving distance of the picture frame 3; the macro-micro adjustment mechanism 4 is arranged under the frame of the picture frame 3, and is used for the macro-fine adjustment of the picture frame 3; The optical elements 2 are arranged in the mirror frame 3 and bonded together by structural glue.

[0018] like figure 2 As shown, there are three bosses 3-1 and three guide bosses 3-2 on the picture frame 3, which are respectively distributed along the circumferential direction of the picture frame at 120°, and the adjacent bosses 3-1 and guide bosses 3-2 The ...

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Abstract

Axial macro-micro adjustment device for optical elements in lithography projection objective lens system, relates to the technical field of structure design and assembly of deep ultraviolet projection lithography objective lens, in order to solve the small adjustment stroke and tilt error existing in the existing optical element axial adjustment device The device includes a capacitive sensor, a frame, a macro-fine adjustment mechanism and a guide rail. The capacitive sensor is set above the frame to detect the moving distance of the frame; the macro-fine adjustment mechanism is set under the frame of the frame to adjust the frame. The macro and micro adjustment; the guide rail is set outside the frame of the picture frame to limit the movement of the picture frame; the picture frame includes three bosses and three guide bosses uniformly distributed in the circumferential direction; the capacitive sensor is set above the boss, macro and micro adjustment The mechanism acts on the boss, and the guide boss cooperates with the guide rail; the device can realize large-stroke adjustment while ensuring the adjustment accuracy; at the same time, the driving structure acts on the frame, reducing the damage to the surface shape of the optical element caused by the adjustment force .

Description

technical field [0001] The invention relates to the technical field of structural design and assembly of deep ultraviolet projection lithography objective lenses, in particular to an axial macro-micro adjustment device for optical elements in a lithography projection objective lens system. Background technique [0002] Projection lithography equipment is the key equipment in the manufacturing process of large-scale integrated circuits. In recent years, with the continuous improvement of the fineness of the line width of integrated circuits, the resolution of projection optical equipment has gradually improved. At present, the ArF excimer laser with a wavelength of 193.368nm Lithography equipment has become the mainstream equipment for integrated circuit manufacturing at 90nm, 65nm and 45nm nodes. [0003] During the assembly process of projection lithography objective lens, in order to obtain good optical performance, various aberrations of the optical system need to be comp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B7/02G03F7/20
Inventor 彭海峰巩岩倪明阳赵磊秦硕
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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