Phase change heat sink

Abstract

A phase change heat dissipation device is used to carry out heat dissipation on a heating element. The device comprises a shell, a working medium arranged in the shell and a heat pipe connected with the shell. The heat pipe comprises an evaporation end and a condensation end. The working medium is a phase change insulation substance which is in a solid state at a normal temperature. The shell accommodates the heating element. The evaporation end of the heat pipe is extended into the shell and is contacted with the working medium. Compared to the prior art, by using the device of the invention, the shell of the phase change heat dissipation device accommodates the heating element and the working medium; the evaporation end of the heat pipe is extended into the shell and is contacted with the working medium; the working medium is the phase change insulation substance which is in the solid state at the normal temperature; during high load operation, the heat generated by the heating element is directly transferred to the working medium so that the working medium is liquefied and transient thermal storage is performed; when the heating element is in a standby state or carries out low-load operation, the working medium continuously carries out heat transmission and exchange and is conducted to an external portion through the heat pipe so that utilization efficiency is high.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a phase change heat dissipation device which utilizes the principle of phase change to dissipate heat generated by electronic components. Background technique [0002] With the rapid development of electronic technology in recent years, the high-frequency and high-speed operation of electronic components and the density and miniaturization of integrated circuits make electronic components continue to generate heat during work. The heat generated during work is taken away to ensure the stable operation of electronic components. [0003] The traditional heat dissipation method is to install a metal heat sink above the heating electronic components. The heat sink has a base, the lower surface of the base is in contact with the electronic components, and a number of cooling fins are provided on the upper surface, and the base absorbs electrons. The heat generated by the components is tra...

AI Technical Summary

Problems solved by technology

However, for some electronic devices with intermittent high-load operation, the high-load operation time is relatively short, and the standby or low-load operation time is relatively long. In a short period of time, it is transmitted to the air in the housing of the electronic device through the heat dissipation fins, resulting in the temperature of the housing being too high in a short period of time, which makes the staff feel uncomfortable when operating; while in standby or low-load operation, heat The components generate less heat without causing the temperature of the outer casing to rise, and the heat dissipation fins are not fully utilized at this time

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