A printed circuit board stress and strain testing system

A technology of stress and strain testing and printed circuit boards, which is applied in the direction of electric/magnetic solid deformation measurement and electromagnetic measurement devices, etc., which can solve the problems of high precision and destructibility of electronic products, which cannot meet the needs of technological development, etc.

Active Publication Date: 2016-04-13
章和技术(广州)有限公司
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Problems solved by technology

Since the strain of the solder joints of the circuit board is smaller and changes rapidly compared with objects in other industries, the general static strain test method cannot meet the requirements, and the high precision and destructibility of this electronic product also make the conventional dynamic strain test It is difficult to monitor the strain of the circuit board in real time by the method, which cannot meet the needs of technological development.

Method used

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  • A printed circuit board stress and strain testing system
  • A printed circuit board stress and strain testing system
  • A printed circuit board stress and strain testing system

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Embodiment Construction

[0019] In order for those skilled in the art to better understand the technical solutions provided by the present invention, the following will be described in conjunction with specific embodiments.

[0020] Stress: When an object is deformed due to external causes (force, temperature change, etc.), an internal force that interacts between various parts of the object is generated to resist the effect of this external cause. This internal force is called stress.

[0021] Strain: It is defined in mechanics as the amount of deformation per unit length produced when a tiny material element is subjected to stress.

[0022] Strain effect: When a conductor or semiconductor material is mechanically deformed under the action of an external force, its resistance value changes accordingly. This phenomenon is called "strain effect".

[0023] Strain electrical measurement method: It is an experimental stress analysis method that uses a resistance strain gauge to measure the surface strain ...

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Abstract

The invention discloses a stress-strain test system for a printed circuit board. The stress-strain test system comprises a strain sensor, a strain tester and an upper computer mechanism; the strain sensor is attached to the printed circuit board and is connected with the strain tester which is connected with the upper computer mechanism. Compared with the prior art, the stress-strain test system for the printed circuit board has the advantages of capability of monitoring the strain condition of the circuit board in real time, good dynamic responding, high precision and the like.

Description

technical field [0001] The invention relates to the field of stress and strain testing, in particular to a printed circuit board stress and strain testing system. Background technique [0002] With the development of science and technology and the continuous innovation of test theory, new engineering stress-strain test methods are also continuously developed and improved. Today, the most widely used test methods are static strain test and dynamic strain test. Since the strain of the solder joints of the circuit board is smaller and changes rapidly compared with objects in other industries, the general static strain test method cannot meet the requirements, and the high precision and destructibility of this electronic product also make the conventional dynamic strain test It is difficult to monitor the strain of the circuit board in real time with the method, which cannot meet the needs of technological development. Contents of the invention [0003] In view of the above d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B7/16
Inventor 顾捷
Owner 章和技术(广州)有限公司
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