Testing method and system of junction-loop thermal resistance
A test method and test system technology, applied in the field of testing, can solve problems such as inaccurate junction-ring thermal resistance test results and inability to accurately measure junction temperature, so as to avoid temperature loss, improve accuracy, and ensure the effect of junction temperature value
Active Publication Date: 2014-01-29
FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
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[0004] Based on this, it is necessary to provide a test method and system for junction-ring thermal resistance to solve the problem of inaccurate measurement of junction temperature and inaccurate test results of junction-ring thermal resistance.
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[0040] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0041] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as...
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The invention discloses a testing method of junction-loop thermal resistance. The testing method of the junction-loop thermal resistance comprises the following steps of measuring and recording the case temperature parameter of a tested sample under a power loading state; unsealing and processing the tested sample; compensating the case temperature after the tested sample is unsealed for testing the temperature, so that the case temperature and the tested case temperature before unsealing are consistent in parameter; and acquiring the junction temperature through infrared thermography, and calculating the junction-loop thermal resistance. Thus, the case temperature of the tested sample is measured before unsealing treatment; the case temperature of the tested sample is compensated by taking the case temperature parameter tested previously as the criterion after unsealing treatment; the temperature loss of the tested sample after unsealing is prevented so as to guarantee that the accurate junction temperature numerical value is obtained; the accuracy of the test result of the junction-loop thermal resistance is improved. The invention also provides a testing system of the junction-loop thermal resistance.
Description
technical field [0001] The invention relates to the technical field of testing, in particular to a testing method and system for junction-ring thermal resistance. Background technique [0002] Junction-ring thermal resistance is an important indicator of the performance parameters of electronic components, which characterizes the heat dissipation capability of the device. In the design and use of electronic components, heat dissipation performance is an important factor that must be considered. Accurate measurement of junction-ring thermal resistance has important reference significance for thermal performance evaluation, design and acceptance of microwave components and hybrid integrated circuits. [0003] Accurately extracting the junction temperature of the device under test is the key to accurately obtaining the junction-ring thermal resistance of the device under test. The junction temperature refers to the highest temperature of the actual semiconductor chip (wafer, d...
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Inventor 宋芳芳何小琦恩云飞
Owner FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH