A method and device for improving the surface integrity of electric discharge high-speed perforation machining
A high-speed perforation and surface processing technology, which is applied in electric processing equipment, accessory devices, metal processing equipment, etc., can solve the problems of low processing efficiency, poor surface integrity of the workpiece, and large surface roughness, so as to reduce the heat-affected zone, Prevents workpiece burns and improves stability
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Embodiment 1
[0030] A device for improving the surface integrity of electric discharge high-speed perforation machining, the structure of the fixture 6 is as follows figure 2 , the clamp 6 includes an upper guide block 14 and a lower guide block 16, the upper guide block 14 and the lower guide block 16 are hollow after clamping, and the upper guide block 14 and the lower guide block 16 are respectively provided with water mist inlets 15 And the chip removal groove 18, the top surface of the upper guide block 14 is also provided with a tool electrode inlet 13, the tool electrode inlet 13, the water mist inlet 15 and the chip removal groove 18 are all communicated with the cavity. The lower guide block 16 is arranged on the base 17, and the above-mentioned upper and lower guide blocks 14, 16 and the base 17 are insulating materials. The structure of the upper guide block and the lower guide block of the fixture is as follows image 3 a and image 3 as shown in b.
[0031] The schematic d...
Embodiment 2
[0038] Such as figure 1 and figure 2 As shown, a device for improving the surface integrity of EDM high-speed perforation machining is different from Example 1 in that the material of the workpiece 7 used is Q235 (thickness 7mm), the discharge pulse width is 40μs, and the duty ratio is 5:3. , The open circuit voltage is 80V, the average current is 28A, the high-speed flushing pressure is 5MPa, the water mist pressure is controlled at 0.6MPa, the flow velocity of the water mist on the surface of the workpiece is 67m / s, and the gas-liquid volume ratio is 200:1.
[0039] In this embodiment, the average processing time for small holes with a diameter of 2mm and a depth of 7mm is about 31s, while the average processing time for the same material and ordinary high-speed EDM under the same processing parameters is about 38s, and the processing efficiency is increased by about 18.42%. The surface morphology was observed by a 3D video microscope, and the surface integrity was signif...
Embodiment 3
[0041] Such as figure 1 and figure 2 As shown, a device for improving the surface integrity of EDM high-speed perforation machining, the difference from Example 1 is that the material of the workpiece 7 used is a single crystal silicon ingot (thickness 5.5mm), and the resistivity is 0.01Ω. cm, the discharge pulse width is 40μs, the duty ratio is 5:3, the no-load voltage is 80V, the average current is 28A, the high-speed flushing pressure is 5MPa, the water mist pressure is controlled at 0.6MPa, and the flow rate of water mist on the surface of the workpiece is 100m / s , The gas-liquid volume ratio is 200:1.
[0042] In this example, the average processing time for a small hole with a diameter of 2mm and a depth of 5.5mm is about 5s, while the average processing time for the same material and ordinary high-speed EDM under the same processing parameters is about 6s, and the processing efficiency is increased by about 16.67%. , the surface morphology was observed through a thr...
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