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Substrate for light emitting elements, material for substrates, and light emitting module

A technology for light-emitting elements and light-emitting modules, which is applied in the directions of electrical components, electrical solid-state devices, semiconductor devices, etc., can solve problems such as the decrease of light quantity of LED devices.

Inactive Publication Date: 2014-02-05
NEOMAX MATERIALS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is considered that there is a problem that the light quantity of the LED device decreases due to a decrease in the light reflection quantity on the Ag plating (light reflection layer)

Method used

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  • Substrate for light emitting elements, material for substrates, and light emitting module
  • Substrate for light emitting elements, material for substrates, and light emitting module
  • Substrate for light emitting elements, material for substrates, and light emitting module

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no. 1 approach ）

[0052] First, refer to Figure 1 ~ Figure 4 , the structure of the LED module 100 according to the first embodiment of the present invention will be described. In addition, the LED module 100 is an example of the "light emitting module" of this invention.

[0053] Such as figure 1 with figure 2 As shown, the LED module 100 according to the first embodiment of the present invention is configured such that one side (X1 side) in the direction (X direction) in which the Cu wirings 102a and 102b of the printed circuit board 102 extend passes through the solder 101a and the Cu wiring 102a. connected, and the other side (X2 side) is connected to Cu wiring 102b via solder 101b. Accordingly, light emission of the LED elements 2 of the LED module 100 is controlled by a control unit (not shown) separately connected to the printed circuit board 102 .

[0054] In addition, the LED module 100 includes: the heat dissipation substrate 1 divided into the X1 side and the X2 side; the LED e...

no. 2 approach ）

[0094] Next, refer to Figure 8 and Figure 9 , to describe the second embodiment of the present invention. In this second embodiment, unlike the above-mentioned first embodiment, a description will be given of the case where the light reflection layer 312 is embedded in the groove portion 311c formed in the base material layer 311 of the heat dissipation substrate 301 of the LED module 300 . In addition, the LED module 300 is an example of the "light emitting module" of the present invention, and the heat dissipation substrate 301 is an example of the "substrate for light emitting element" and "substrate body for light emitting element" of the present invention.

[0095] In the second embodiment of the present invention, as Figure 8 As shown, a groove portion 311 c is formed in the base material layer 311 of the heat dissipation substrate 301 of the LED module 300 . The groove portion 311c has a length L2 of about 3 mm in the X direction at the center and its periphery on...

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Abstract

Provided is a substrate for light emitting elements, which is capable of suppressing decrease in the quantity of light of a light emitting module due to decrease in the quantity of reflected light at a light-reflecting layer. This substrate (1) for light emitting elements comprises a base layer (11) that has a bonding region (13) which can be bonded to a light-reflecting layer (12). The light-reflecting layer is compression bonded to the whole or a part of the bonding region of the base layer.

Description

technical field [0001] The present invention relates to a substrate for a light-emitting element, a material for the substrate, and a light-emitting module, and in particular to a substrate for a light-emitting element provided with a light-reflecting layer, a material for a substrate including a portion of the substrate for a light-emitting element, and a light-emitting device having the substrate for a light-emitting element. module. Background technique [0002] Conventionally, there is known a light-emitting module including a substrate for a light-emitting element provided with a light-reflecting layer. For example, Japanese Patent Application Laid-Open No. 2008-10591 discloses such a light-emitting module including a light-emitting element substrate provided with a light-reflecting layer. [0003] Japanese Patent Application Laid-Open No. 2008-10591 discloses an LED device including a substrate made of ceramics and LED chips arranged on the surface of the substrate. ...

Claims

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Application Information

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IPC IPC(8): H01L33/60
CPCH01L33/60H01L33/642H01L2224/45144H01L2224/48091H01L2224/73265H01L2924/00014H01L2924/00H01L33/48
Inventor 山本晋司织田喜光石尾雅昭
Owner NEOMAX MATERIALS