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Circuit board surface treatment method

A surface treatment and circuit board technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problem of high cost

Active Publication Date: 2016-02-03
KIN YIP TECHNOLDGY ELECTRONICS HUI ZHOUCO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the gradual increase in the price of gold, the cost of the traditional surface treatment process of printed circuit boards has become very high

Method used

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  • Circuit board surface treatment method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0157] Using 1.0mm thick FR-4 substrate, after drilling, copper plating, wiring, electroplating, green oil, and electroless nickel plating, the following treatment is performed to obtain a circuit board sample of electroless nickel silver plating.

[0158] Immersion silver pre-soaking: At a temperature of 35°C, put the electroless nickel-plated circuit board into the immersion silver pre-soaking solution for 2 minutes. The immersion silver pre-soaking solution contains 1.6% nitric acid, 5% ethyl alcohol Diaminetetraacetic acid.

[0159] Electroless silver plating: At a temperature of 50°C, put the circuit board that has completed the pre-impregnation of silver into the chemical immersion silver solution for 2 minutes. The chemical immersion silver solution contains 3.2% nitric acid, 5% silver nitrate, 10 % of ethylenediaminetetraacetic acid.

[0160] Water washing: the circuit board sample after electroless silver plating was washed with deionized water for 1.5 minutes at roo...

Embodiment 2

[0177] Using 1.0mm thick FR-4 substrate, after drilling, copper plating, wiring, electroplating, green oil, and electroless nickel plating, the following treatment is performed to obtain a circuit board sample of electroless nickel silver plating.

[0178] Immersion silver pre-soaking: At a temperature of 38°C, put the electroless nickel-plated circuit board into the immersion silver pre-soaking solution for 2 minutes. The immersion silver pre-soaking solution contains 1.6% nitric acid, 5% ethyl alcohol Diaminetetraacetic acid.

[0179] Electroless silver plating: At a temperature of 51°C, place the circuit board that has been pre-impregnated with immersion silver into the chemical immersion silver solution for 2 minutes. The chemical immersion silver solution contains 3.2% nitric acid, 5% silver nitrate, 10 % of ethylenediaminetetraacetic acid.

[0180] Water washing: the circuit board sample after electroless silver plating was washed with deionized water for 1.5 minutes at...

Embodiment 3

[0197] Using 1.0mm thick FR-4 substrate, after drilling, copper plating, wiring, electroplating, green oil, and electroless nickel plating, the following treatment is performed to obtain a circuit board sample of electroless nickel silver plating.

[0198] Immersion silver pre-soaking: At a temperature of 36°C, put the electroless nickel-plated circuit board into the immersion silver pre-soaking solution for 2 minutes. The immersion silver pre-soaking solution contains 1.6% nitric acid, 5% ethyl alcohol Diaminetetraacetic acid.

[0199] Electroless silver plating: At a temperature of 51°C, place the circuit board that has been pre-impregnated with immersion silver into the chemical immersion silver solution for 2 minutes. The chemical immersion silver solution contains 3.2% nitric acid, 5% silver nitrate, 10 % of ethylenediaminetetraacetic acid.

[0200] Water washing: the circuit board sample after electroless silver plating was washed with deionized water for 1.5 minutes at...

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Abstract

The invention discloses a circuit board surface treatment method. The circuit board surface treatment method comprises the following steps of treating a circuit board by an acidic oil-removal liquid at a temperature of 35-45 DEG C, treating the circuit board by a micro-etching liquid at a temperature of 25-35 DEG C, treating the circuit board by an acid liquid at a temperature of 45-55 DEG C, treating the circuit board by a presoak at a room temperature, treating the presoaked circuit board by an activation liquid at a temperature of 25-31 DEG C, treating the circuit board by an after-soak at the room temperature, carrying out chemical nickel-plating on the circuit board at a temperature of 80-84 DEG C, treating the circuit board by a silver precipitation presoak at a temperature of 32-43 DEG C, and carrying out chemical silver-precipitation on the circuit board presoaked with silver at a temperature of 43-54 DEG C to obtain the circuit board subjected to surface treatment. The circuit board surface treatment method utilizes cheap silver to replace gold and thus compared with the traditional surface treatment technology adopting nickel and gold chemical plating, the circuit board surface treatment method has a low cost.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a surface treatment method for a circuit board. Background technique [0002] In the manufacturing process of a printed circuit board, the final surface solderability treatment of the product plays a vital role in the assembly and use of the final product. [0003] The surface treatment of traditional printed circuit boards mostly adopts electroless nickel-plated gold process. However, as the price of gold gradually rises, the cost of the traditional surface treatment process of printed circuit boards becomes very high. Contents of the invention [0004] Based on this, a method for treating the surface of the circuit board with lower cost is provided. [0005] A method for surface treatment of a circuit board, comprising the steps of: [0006] Step 1. Treat the circuit board with an acidic degreasing solution at 35°C~45°C; [0007] Step 2, treating the circuit board ob...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/20C23C18/31
Inventor 黄锡金
Owner KIN YIP TECHNOLDGY ELECTRONICS HUI ZHOUCO LTD