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Phosphor powder colloid preparation method and corresponding light-emitting diode packaging method

A technology of light-emitting diodes and phosphors, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., and can solve problems that affect the light-emitting performance of the packaging structure of light-emitting diodes and the uneven distribution of phosphors.

Active Publication Date: 2016-12-21
广州市晶鑫光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the phosphor particles mixed in the encapsulant tend to precipitate after being placed for a period of time, which makes the distribution of the phosphor in the encapsulant uneven, thus affecting the light extraction performance of the LED encapsulation structure

Method used

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  • Phosphor powder colloid preparation method and corresponding light-emitting diode packaging method
  • Phosphor powder colloid preparation method and corresponding light-emitting diode packaging method
  • Phosphor powder colloid preparation method and corresponding light-emitting diode packaging method

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Embodiment Construction

[0024] The method for preparing phosphor colloid and the method for encapsulating light-emitting diodes of the present invention will be further described below with reference to the figures.

[0025] See Figure 1-Figure 2 , providing a silicone resin, and then modifying an amino functional group on the silicon atom of the silicone resin.

[0026] Please also refer to image 3 , providing a phosphor, and modifying a hydroxyl functional group on the phosphor particle 20 . In this embodiment, the material of the phosphor is selected from one of yttrium aluminum garnet, sulfide, silicate, nitride and oxynitride or a mixture thereof. The carboxyl functional group is formed on the surface of the phosphor particle 20 by physical adsorption.

[0027] Please also refer to Figure 4 , mix the silicone resin with the phosphor powder and undergo a chemical reaction, so that the silicon atoms and the phosphor particles 20 form amide bonds and combine together. In this implementation...

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Abstract

A preparation method for a florescent power colloid comprises the following steps: silicone resin is provided, and a silicon atom of the silicone resin is modified with an amide functional group; phosphor powder is provided and a particle of the phosphor powder is modified with a carboxyl functional group; the silicone resin and the phosphor powder are mixed and are subjected to chemical reaction, so that an amide bond forms between the silicon atom and the phosphor powder particle, and the silicon atom and the phosphor powder particle are combined together; and a curing agent is added to a mixture of the silicone resin and the phosphor powder, so that the mixture solidifies. According to the preparation method for the above florescent power colloid, since the amide bond forms between the silicon atom and the phosphor particle through the chemical reaction, phosphor particles can be uniformly distributed in the silicone resin. The invention also provides a corresponding method for packaging a light emitting diode through the utilization of the above the preparation method for the florescent power colloid.

Description

technical field [0001] The invention relates to a method for preparing fluorescent powder colloid and a method for encapsulating light-emitting diodes using the method for preparing fluorescent powder colloid. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is an optoelectronic semiconductor element that can convert current into a specific wavelength range. Light-emitting diodes can be widely used as light sources in the field of lighting because of their advantages such as high brightness, low operating voltage, low power consumption, easy matching with integrated circuits, simple driving, and long life. [0003] Phosphor powder is usually included in the packaging structure of light emitting diodes. The phosphor powder is usually mixed in the encapsulant to change the color of the light emitted by the LED. However, the phosphor particles mixed in the encapsulant tend to precipitate after being placed for a period of time, so that the dist...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50H01L33/48
CPCH01L33/501H01L33/60H01L2933/0041
Inventor 毛小荣
Owner 广州市晶鑫光电科技有限公司