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Rigid-flex circuit substrate, rigid-flex circuit board and manufacturing method

A soft-rigid combination, circuit substrate technology, applied in the direction of multi-layer circuit manufacturing, printed circuit components, and electrical components to assemble printed circuits, which can solve the low efficiency of flexible and rigid circuit boards and the long production process of flexible circuit boards. and other problems, to achieve the effect of improving reliability, reducing production costs and improving efficiency

Active Publication Date: 2017-02-15
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, in the production process of the flexible and rigid circuit board, it is necessary to carry out multiple pressing and conductive circuit production steps, so that the production process of the flexible and rigid circuit board is relatively long, and the efficiency of the production of the flexible and rigid circuit board is low.

Method used

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  • Rigid-flex circuit substrate, rigid-flex circuit board and manufacturing method
  • Rigid-flex circuit substrate, rigid-flex circuit board and manufacturing method
  • Rigid-flex circuit substrate, rigid-flex circuit board and manufacturing method

Examples

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Embodiment Construction

[0104] The method for manufacturing a rigid-flex circuit board provided in the first embodiment of the technical solution includes the following steps:

[0105] For a first step, see figure 1 , providing a flexible circuit board 110 .

[0106] The flexible circuit board 110 is a circuit board fabricated with conductive circuits. The flexible circuit board 110 can be a single-sided circuit board or a double-sided circuit board. In this embodiment, the flexible printed circuit board 110 is taken as an example for illustration. The flexible circuit board 110 includes a first cover film 118, a first electromagnetic shielding layer 116, a second insulating layer 114, a first conductive circuit layer 112, a first insulating layer 111, a second conductive circuit layer 113, a third The insulating layer 115 , the second electromagnetic shielding layer 117 and the second covering film 119 . The first insulating layer 111 includes a first surface 1111 and a second surface 1112 oppos...

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Abstract

PROBLEM TO BE SOLVED: To provide a rigid flexible circuit substrate and a method of manufacturing the same, and a rigid flexible circuit board and a method of manufacturing the same.SOLUTION: A rigid flexible circuit substrate of the present invention includes a flexible circuit substrate having an exposure region and a press region connected to the exposure region, a first laminating adhesive sheet connected to the press region, a second laminating adhesive sheet and a third laminating adhesive sheet positioned on both sides of the first laminating adhesive sheet and press region, and a third conductive circuit layer and a fourth conductive circuit layer formed on surfaces of the second laminating adhesive sheet and third laminating adhesive sheet, respectively. The first laminating adhesive sheet, second laminating adhesive sheet, and third laminating adhesive sheet all have an electric connection body formed, and a conductive circuit layer of the flexible circuit substrate is electrically connected to the third conductive circuit layer and fourth conductive circuit layer by the electric connection body. There are also disclosed a method of manufacturing the rigid flexible circuit substrate, and a rigid flexible circuit board and a method of manufacturing the same.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a rigid-flex circuit substrate and a manufacturing method thereof, a rigid-flex circuit board and a manufacturing method thereof. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, Highdensity multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 1418-1425. [0003] Rigid-flex circuit board is a circuit board structure including interconnected flexible boards and rigid boards, which can not only have the flexibility of flexible circuit boards, but also include the hardness of rigid circuit boards. In the production process of the flexible and rigid circuit board, it is formed b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/46H05K3/36
Inventor 刘于甄
Owner AVARY HLDG (SHENZHEN) CO LTD
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