33results about How to "Reduce the number of pressing" patented technology

The invention relates to a plastic woven bag edgefold shaping machine and a method. The machine comprises a clamping base, a working electric sliding block, a displacement frame, a synchronizing device, two positioning clamps, a portal frame, a driving cylinder, a pressing device and a mark ironing device. The working electric sliding block is mounted on the clamping base. The displacement frame is arranged on the working electric sliding block. The synchronizing device is mounted in the middle of the displacement frame. The two positioning clamps are mounted at the left and right ends of thesynchronizing device. The mark ironing device is mounted in the middle of the displacement frame. The portal frame is mounted on the displacement frame. The upper end of the portal frame is connectedwith the pressing device through the driving cylinder. By means of the plastic woven bag edgefold shaping machine and the method, the problems that an existing edgefold machine commonly adopts rigid pressing for woven fabric, two pressing dies are adopted for pressing the woven fabric repeatedly, clear folding marks can only be obtained through repeated pressing since the woven fabric is flexiblefabric, and the edgefold shaping effect is poor can be solved.

The invention relates to a manufacturing method for embedding a metal matrix into a printed board. The manufacturing method comprises the steps of (1) finishing circuit manufacturing on a line layer needing to be laminated; (2) obtaining an outline of the metal matrix needing to be embedded in a milling or punching manner; (3) forming a corresponding embedded groove in the printed board according to the outline and the size of the metal matrix in a milling or punching manner; (4) embedding the metal matrix into the embedded groove of the printed board; and (5) laminating the circuit layer and the printed board embedded with the metal matrix together by using prepreg. The manufacturing method reduces the lamination times and reduces the moulding of the prepreg without controlling the milling groove depth; and in addition, simple product manufacturing, higher efficiency and better quality are realized.

The invention discloses a blind buried hole printed circuit board, and the circuit board comprises multiple layers of copper-clad plates, and bonding sheets arranged between two adjacent layers of copper-clad plates; resin columns are disposed in the copper-clad plates, and second metal layers are disposed at the tail ends of the resin columns, wherein a first metal layer is connected with the second metal layers; copper paste is disposed in the bonding sheets, wherein the copper paste is connected with the second metal layers. The invention further comprises a manufacturing method of the blind buried hole printed circuit board. Holes are formed in the positions, corresponding to the blind buried holes, of the bonding sheets, and the copper paste is plugged into the holes; the copper pasteand a metal film are sintered together in the pressing process of the bonding sheets and the copper-clad plates, thereby achieving the interlayer interconnection; a PET film is attached to the bonding sheets before the bonding sheets are plugged into the holes through the copper paste for protection. According to the technical scheme, the lamination frequency can be reduced, the production efficiency can be improved, a printed circuit board with a blind buried hole structure can be realized for many times, the outermost layer copper plating frequency can be reduced, the outer layer copper thickness can be reduced, a smaller line width / spacing can be manufactured, and the circuit density of the circuit board can be improved.

The invention discloses a circuit board and a manufacturing method thereof. The manufacturing method of the circuit board includes the following steps: providing a multilayer board, wherein the multilayer board has a top surface and a bottom surface; implementing a first hole drilling step to form a first through hole running through the top surface and the bottom surface of the multilayer board;implementing a through hole plating step to plate a first conductive layer on the hole wall of the first through hole; implementing a first hole plugging step to fill the first through hole with resin; and implementing a second hole drilling step: carrying out hole drilling towards the first conductive layer of the multilayer board to form two first perforations which run through the top surface and the bottom surface of the multilayer board and are distributed at intervals, wherein each first perforation partially overlaps the first through hole, and part of the first conductive layer is removed so that the first conductive layer forms two first sub conductive layers separated from each other.

The invention relates to a soft-hard circuit board and a process thereof. The soft-hard circuit board comprises a hard circuit board, a first soft circuit board, a first outer composite layer and a plurality of first conductive connecting structures. The hard circuit board is provided with an upper surface, a lower surface opposite to the upper surface and a groove. The first outer composite layer is provided with a first opening communicated with the groove, and comprises a first outer circuit layer and a first insulating layer. The first insulating layer is arranged between the first outer circuit layer and the upper surface. The first soft circuit board is arranged on the first insulating layer and covers the groove. The first insulating layer is locally covered on the first soft circuit board. The first conductive connecting structures are arranged in the first insulating layer and electrically connected between the hard circuit board and the first soft circuit board. The soft-hard circuit board can reduce the demand of flexible substrates and greatly reduce the manufacturing cost, and also has the advantages of saving the assembly space and reducing the soft board length and the soft board pressing times.

The invention relates to a shock absorber assembling technology, in particular to an assembling method of an oil seal guider assembly, which comprises the following steps of: A, sleeving an annular boss with an annular sealing body; b, an oil seal and a guider are pressed into the outer cylinder together; and C, after the guider is positioned, pressure is continuously applied to the oil seal, so that the annular sealing body is expanded to be in interference fit with the outer cylinder and the annular boss. According to the oil seal guider assembly, the characteristic that the annular sealing body made of rubber is deformed before and after being compressed is utilized, the press-fitting frequency in the assembling process of the oil seal guider assembly is reduced, and the assembling efficiency of a shock absorber is improved.

The invention relates to the field of molds, in particular to a low-pressure mold transformation technology. The technology comprises the steps of 1) cutter processing; 2) processing for a lower spherical part; 4) processing for an upper spherical part; 5) mold installation. According to the transformation technology, the surfaces of upper and lower molds are transformed into a micro-spherical cambered surface shape, and patterns and characters are carved into a micro cambered surface through a projection carving mode. The technology has the advantages that a workblank precious metal materialwith the thickness below 1.5 millimeters is better formed, and the product presses more full patterns and clear handwriting; the pressure tonnage required by product pressing is lowered, the service life of the molds is effectively prolonged, the dangerous factors such as mold cracking are reduced, and safety production is guaranteed; the pressing frequency is lowered, and the production efficiency of a pressing link is improved.

A method for manufacturing a multilayer circuit board, comprising the following steps: providing an inner circuit substrate, the inner circuit substrate at least including a base material layer and a first conductive circuit layer formed on a surface of the base material layer; The first conductive circuit layer includes a plurality of first conductive circuits; a first cover film is formed on the first conductive circuit layer, and the first cover film includes a first opening, and a part of the first conductive circuit from the first exposed in the opening; an outer line seed layer is formed on the first cover film, and an inner line protection layer is formed on the first conductive line exposed from the first opening, and the inner line protection layer The layer is non-copper metal or resist; forming a third conductive circuit layer on the outer circuit seed layer; and removing the outer circuit seed layer and the inner circuit protection layer. The manufacturing method of the multi-layer circuit board provided by the invention can reduce work flow and improve circuit reliability.

The invention relates to a manufacturing method for a printed circuit board, and the printed circuit board. The method comprises the steps: drilling a first prefabricated plate to obtain a first sub-board with a first connecting hole, and drilling a second prefabricated plate to obtain a second sub-board with a second connecting hole; pre-pressing a first bonding sheet on the first sub-board; forming a first via hole corresponding to the first connecting hole on the first bonding sheet; and performing the stitching of the first sub-board and the second sub-board through the first bonding sheet. The printed circuit board is fabricated through the above-described manufacturing method. According to the printed circuit board as described above, the connection holes in the printed circuit boardare divided according to the apertures and the center distances of the holes in the printed circuit board, sand the first and second sub-board which are different are separated out, and then the first sub-board and the second sub-board are connected by through the first bonding sheet including the first via hole.

The invention provides a vacuum blank adsorption structure which is simple in structure, low in cost, stable in work and capable of effectively ensuring stripes and patterns of a ceramic tile blank. The vacuum blank adsorption structure comprises a vacuum adsorption die used for adsorbing the ceramic tile blank, a lifting drive cylinder used for driving the vacuum adsorption die to rise and fall and a vacuum generation device used for enabling the vacuum adsorption die to generate a vacuum gas source. The bottom end face of the vacuum adsorption die is provided with a plurality of longitudinally and transversely formed air suction and exhaust grooves in an intersected mode. The intersection of each pair of intersected air suction and exhaust grooves is provided with an air hole communicating with the vacuum generation device. Compared with the prior art, according to the scheme, by adoption of the structural form, the traditional mode that a ceramic tile blank is conveyed into a press through a fidelity grating is changed, and the vacuum blank adsorption structural form in the scheme is utilized, and by adsorbing the ceramic tile blank through vacuum, it can be ensured that the blank is not prone to shaking in the transferring process, and the whole conveying process is stable.

The invention discloses a multilayer circuit board preparation method and a multilayer circuit board, and the method comprises the steps: blanking: providing at least two circuit board units and at least one link plate, and enabling two opposite side surfaces of each circuit board unit to be provided with a first circuit and a second circuit in a one-to-one correspondence manner, wherein each linkplate is provided with a first via hole penetrating through the link plate, and a first conductive material layer is formed in the first via hole; and stacking and lamination: stacking the circuit board units and the link plates sequentially in a staggered mode from top to bottom, performing lamination processing, forming a multilayer circuit board, and connecting second circuits of the circuit board units with first circuits of the adjacent circuit board units through first conductive material layers; According to the preparation method, the circuit board units are prepared in advance, thenthe circuit board units are stacked according to a preset sequence, the link plates are stacked between every two adjacent circuit board units, every two adjacent circuit board units are integrated into a whole through the link plates, and it is guaranteed that the multilayer circuit board can still keep good conduction performance under the condition of external force.

The invention discloses a circuit board and a manufacturing method thereof. The manufacturing method of the circuit board includes the following steps: providing a multilayer board, wherein the multilayer board has a top surface and a bottom surface; implementing a first hole drilling step to form a first through hole running through the top surface and the bottom surface of the multilayer board;implementing a through hole plating step to plate a first conductive layer on the hole wall of the first through hole; implementing a first hole plugging step to fill the first through hole with resin; and implementing a second hole drilling step: carrying out hole drilling towards the first conductive layer of the multilayer board to form two first perforations which run through the top surface and the bottom surface of the multilayer board and are distributed at intervals, wherein each first perforation partially overlaps the first through hole, and part of the first conductive layer is removed so that the first conductive layer forms two first sub conductive layers separated from each other.

A rigid-flex circuit substrate, comprising: a flexible circuit board, a core substrate, a first lamination film, a second lamination film, a third conductive circuit layer and a fourth conductive circuit layer, the flexible circuit board It includes an exposed area and a pressing area connected to the exposed area. The core substrate is connected to the pressing area. The first lamination film and the second lamination film are formed on both sides of the lamination area of ​​the core substrate and the flexible circuit board. An electrical connector is formed in the core substrate, the first and the second laminated film, and the conductive circuit layer of the flexible circuit board is electrically connected with the third conductive circuit layer and the fourth conductive circuit layer through the electrical connector. The present invention also provides a manufacturing method of the rigid-flex circuit board, a rigid-flex circuit board and a manufacturing method thereof.

This application is applicable to the technical field of flexible circuit boards, and proposes a method for manufacturing copper paste plugged printed boards, including: attaching a heat-relieving adhesive protective film to the side of the board away from the circuit layer; The peeling force of the adhesive protective film after bonding is greater than 500g / cm 2 ; Make a blind hole on the plate from one side of the heat-reducing adhesive protective film; insert copper paste into the blind hole; bake the plate, and the heat-reducing adhesive protective film is The peel force after baking is less than 15g / cm 2 ; Peel off the heat-reducing adhesive protective film to obtain a copper paste plugged printed board. The above-mentioned manufacturing method of the copper paste plugged printed board can prevent the copper paste from polluting the board surface, and at the same time prevent the board surface from being torn and deformed by glue, thereby improving production efficiency and product yield. The present application also proposes a method for manufacturing an FPC board.

The invention relates to a manufacturing method for embedding a metal matrix into a printed board. The manufacturing method comprises the steps of (1) finishing circuit manufacturing on a line layer needing to be laminated; (2) obtaining an outline of the metal matrix needing to be embedded in a milling or punching manner; (3) forming a corresponding embedded groove in the printed board according to the outline and the size of the metal matrix in a milling or punching manner; (4) embedding the metal matrix into the embedded groove of the printed board; and (5) laminating the circuit layer and the printed board embedded with the metal matrix together by using prepreg. The manufacturing method reduces the lamination times and reduces the moulding of the prepreg without controlling the milling groove depth; and in addition, simple product manufacturing, higher efficiency and better quality are realized.

The invention relates to a plastic woven bag edgefold shaping machine and a method. The machine comprises a clamping base, a working electric sliding block, a displacement frame, a synchronizing device, two positioning clamps, a portal frame, a driving cylinder, a pressing device and a mark ironing device. The working electric sliding block is mounted on the clamping base. The displacement frame is arranged on the working electric sliding block. The synchronizing device is mounted in the middle of the displacement frame. The two positioning clamps are mounted at the left and right ends of thesynchronizing device. The mark ironing device is mounted in the middle of the displacement frame. The portal frame is mounted on the displacement frame. The upper end of the portal frame is connectedwith the pressing device through the driving cylinder. By means of the plastic woven bag edgefold shaping machine and the method, the problems that an existing edgefold machine commonly adopts rigid pressing for woven fabric, two pressing dies are adopted for pressing the woven fabric repeatedly, clear folding marks can only be obtained through repeated pressing since the woven fabric is flexiblefabric, and the edgefold shaping effect is poor can be solved.

The invention discloses a rubber bushing automatic oil coating pressing and closed-loop pressing compensation system. The system comprises a shell, a position sensor for detecting a pressing depth and a position, a floating spring mechanism, a rubber bushing pressing head and a rubber bushing; the rubber bushing is positioned on the rubber bushing pressing head; the position sensor is connected with the floating spring mechanism; the rubber bushing pressing head and the rubber bushing are in control connection; and the shell is positioned at the tops of the rubber bushing pressing head and the rubber bushing. Through the mode, the rubber bushing automatic oil coating pressing and closed-loop pressing compensation system, provided by the invention, realizes an automatic procedural learning function, and can reduce the pressing times to save the equipment beat.

The invention discloses a joint method suitable for jointing a display panel and a plurality of chips. A plurality of first join pads are arranged in a first peripheral circuit territory of the display panel, and a plurality of second joint pads are arranged in a second periphery circuit territory of the display panel. The joint method comprises the following steps: first, a first anisotropic conductive adhesive is attached to the first joint pad; a plurality of first chips are arranged on the first anisotropic adhesive; the first pressing manufacture process is carried out so that the first chips are electrically connected with the first joint pads; a second anisotropic conductive adhesive is attached to the second joint pads; and a plurality of second chips and at least one flexible circuit board are arranged on the second anisotropic conductive adhesive; then the second pressing manufacture process is carried out, so that the second chips and one end of the flexible circuit board are electrically connected with the second joint pads through the second anisotropic conductive adhesive. The joint method provided by the invention makes use of few steps to joint the plurality of chips and the display panel, thereby reducing manufacturing cost of a display device.

PROBLEM TO BE SOLVED: To provide a rigid flexible circuit substrate and a method of manufacturing the same, and a rigid flexible circuit board and a method of manufacturing the same.SOLUTION: A rigid flexible circuit substrate of the present invention includes a flexible circuit substrate having an exposure region and a press region connected to the exposure region, a first laminating adhesive sheet connected to the press region, a second laminating adhesive sheet and a third laminating adhesive sheet positioned on both sides of the first laminating adhesive sheet and press region, and a third conductive circuit layer and a fourth conductive circuit layer formed on surfaces of the second laminating adhesive sheet and third laminating adhesive sheet, respectively. The first laminating adhesive sheet, second laminating adhesive sheet, and third laminating adhesive sheet all have an electric connection body formed, and a conductive circuit layer of the flexible circuit substrate is electrically connected to the third conductive circuit layer and fourth conductive circuit layer by the electric connection body. There are also disclosed a method of manufacturing the rigid flexible circuit substrate, and a rigid flexible circuit board and a method of manufacturing the same.