How to make a multilayer circuit board
A technology of multilayer circuit board and manufacturing method, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., and can solve problems such as poor analysis of outer layer circuits, increased accessories process, and etched circuits.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0028] In order to further illustrate the technical means and effects that the present invention takes to reach the intended purpose of the invention, the following in conjunction with the appended Figure 1-8 And the preferred implementation mode, the specific implementation mode, structure, features and effects of the method for manufacturing a multilayer circuit board provided by the present invention are described in detail as follows.
[0029] see Figure 1-8 , the present invention provides a method for manufacturing a multilayer circuit board 100, comprising the following steps:
[0030] For a first step, see Figure 1-2 , providing an inner layer circuit substrate 10 , a first cover film 21 and a second cover film 22 .
[0031] Wherein, the inner circuit substrate 10 includes a base material layer 11 and a first conductive circuit layer 12 and a second conductive circuit layer 13 formed on opposite surfaces of the base material layer 11 .
[0032] Wherein, the subst...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com