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A method of manufacturing a printed board inlaid with a metal base

A manufacturing method and technology of printed boards, applied in printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the difficulty in ensuring the thickness of the dielectric layer between the metal base and the circuit layer, the difficulty in meeting the requirements for the control accuracy of the depth of the groove, and the prepreg Problems such as gong shape are needed to achieve the effect of reducing molding, simple production, and reducing the number of pressing times

Active Publication Date: 2018-12-11
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the metal base is inserted into the FR4 printed board during the production process, the FR4 substrate needs to be milled out, and a certain thickness of the dielectric layer and the circuit layer should be reserved. This method has the following defects: 1. The shape of the prepreg is required; 2. The control accuracy of the depth of the groove is difficult to meet the requirements, and it is difficult to ensure the thickness of the dielectric layer between the metal base and the circuit layer. ; 3. Need to increase the number of pressing

Method used

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  • A method of manufacturing a printed board inlaid with a metal base
  • A method of manufacturing a printed board inlaid with a metal base

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Embodiment Construction

[0018] The present invention will be described in further detail below in conjunction with the embodiment given with accompanying drawing.

[0019] Such as figure 1 and figure 2 As shown, a method for manufacturing a printed board with a metal base, comprising:

[0020] (1) Complete the circuit production of the required circuit layer 1;

[0021] (2) Extrude or punch out the shape of the metal base 2 to be inserted;

[0022] (3) According to the shape and size of the metal base 2, punch out or punch out the corresponding embedded groove 31 on the printed board 3;

[0023] (4) Insert the metal base 2 into the embedding groove 31 of the printed board 3;

[0024] (5) Using the prepreg 4 to press the circuit layer 1 and the printed board 3 embedded with the metal base 2 together. When pressing, the prepreg 4 is located between the circuit layer 1 and the printed board 3, and the prepreg 4 is polymerized under high temperature and high pressure to form a solid polymer, so tha...

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PUM

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Abstract

The invention relates to a manufacturing method for embedding a metal matrix into a printed board. The manufacturing method comprises the steps of (1) finishing circuit manufacturing on a line layer needing to be laminated; (2) obtaining an outline of the metal matrix needing to be embedded in a milling or punching manner; (3) forming a corresponding embedded groove in the printed board according to the outline and the size of the metal matrix in a milling or punching manner; (4) embedding the metal matrix into the embedded groove of the printed board; and (5) laminating the circuit layer and the printed board embedded with the metal matrix together by using prepreg. The manufacturing method reduces the lamination times and reduces the moulding of the prepreg without controlling the milling groove depth; and in addition, simple product manufacturing, higher efficiency and better quality are realized.

Description

technical field [0001] The invention belongs to the technical field of manufacturing metal-based printed circuit boards, and in particular relates to a method for manufacturing a printed circuit board inlaid with a metal base. Background technique [0002] The inlaid metal base is to increase the local heat dissipation function of the printed board. Generally, a copper block or an aluminum block (other materials can also be used) is embedded in the traditional FR4 printed board. When the metal base is inserted into the FR4 printed board during the production process, the FR4 substrate needs to be milled out, and a certain thickness of the dielectric layer and the circuit layer should be reserved. This method has the following defects: 1. The shape of the prepreg is required; 2. The control accuracy of the depth of the groove is difficult to meet the requirements, and it is difficult to ensure the thickness of the dielectric layer between the metal base and the circuit layer....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0011H05K2201/10416
Inventor 肖世翔朱红
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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